Part Details for EDI8F8257C100B6I by White Electronic Designs Corp
Overview of EDI8F8257C100B6I by White Electronic Designs Corp
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for EDI8F8257C100B6I
EDI8F8257C100B6I CAD Models
EDI8F8257C100B6I Part Data Attributes:
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EDI8F8257C100B6I
White Electronic Designs Corp
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Datasheet
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EDI8F8257C100B6I
White Electronic Designs Corp
SRAM Module, 256KX8, 100ns, CMOS, DIP-32
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WHITE ELECTRONIC DESIGNS CORP | |
| Package Description | DIP-32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 100 ns | |
| JESD-30 Code | R-XDMA-T32 | |
| Memory Density | 2097152 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256KX8 | |
| Package Body Material | UNSPECIFIED | |
| Package Shape | RECTANGULAR | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Alternate Parts for EDI8F8257C100B6I
This table gives cross-reference parts and alternative options found for EDI8F8257C100B6I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EDI8F8257C100B6I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| EMS256K8BMO2-45I | SRAM Module, 256KX8, 45ns, CMOS, CDMA32 | ELMOS SEMICONDUCTOR AG | EDI8F8257C100B6I vs EMS256K8BMO2-45I |
| MSM8256VLI-35/X0252 | SRAM Module, 256KX8, 35ns, CMOS, CDIP32, 0.100 INCH, CERAMIC, VIL-32 | APTA Group Inc | EDI8F8257C100B6I vs MSM8256VLI-35/X0252 |
| EDI8M8256P150C6C | SRAM Module, 256KX8, 150ns, CMOS, | Electronic Designs Inc | EDI8F8257C100B6I vs EDI8M8256P150C6C |
| EDI8F8257P100BPI | SRAM Module, 256KX8, 100ns, CMOS, | Electronic Designs Inc | EDI8F8257C100B6I vs EDI8F8257P100BPI |
| EDI8M8257P120C6C | SRAM Module, 256KX8, 120ns, CMOS, | Electronic Designs Inc | EDI8F8257C100B6I vs EDI8M8257P120C6C |
| EMS256K8AMO6-25I | SRAM Module, 256KX8, 25ns, CMOS, PDMA32 | ELMOS SEMICONDUCTOR AG | EDI8F8257C100B6I vs EMS256K8AMO6-25I |
| EDI8M8257C70C6C | SRAM Module, 256KX8, 70ns, CMOS, | Electronic Designs Inc | EDI8F8257C100B6I vs EDI8M8257C70C6C |
| EDI8M8257C150N6I | SRAM Module, 256KX8, 150ns, CMOS, | Electronic Designs Inc | EDI8F8257C100B6I vs EDI8M8257C150N6I |
| 5962-9315702HXX | SRAM Module, 256KX8, 100ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | White Electronic Designs Corp | EDI8F8257C100B6I vs 5962-9315702HXX |
| EDI88257LPA45CC | Standard SRAM, 256KX8, 45ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | EDI8F8257C100B6I vs EDI88257LPA45CC |