Part Details for EMS256K8BMO2-45I by ELMOS SEMICONDUCTOR AG
Overview of EMS256K8BMO2-45I by ELMOS SEMICONDUCTOR AG
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for EMS256K8BMO2-45I
EMS256K8BMO2-45I CAD Models
EMS256K8BMO2-45I Part Data Attributes:
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EMS256K8BMO2-45I
ELMOS SEMICONDUCTOR AG
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Datasheet
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EMS256K8BMO2-45I
ELMOS SEMICONDUCTOR AG
SRAM Module, 256KX8, 45ns, CMOS, CDMA32
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ELMO SEMICONDUCTOR CORP | |
Package Description | DIP, DIP32,.6 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 45 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-CDMA-T32 | |
JESD-609 Code | e0 | |
Memory Density | 2097152 bit | |
Memory IC Type | SRAM MODULE | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 256KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | DIP | |
Package Equivalence Code | DIP32,.6 | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Standby Current-Max | 0.004 A | |
Standby Voltage-Min | 4.5 V | |
Supply Current-Max | 0.14 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |
Alternate Parts for EMS256K8BMO2-45I
This table gives cross-reference parts and alternative options found for EMS256K8BMO2-45I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EMS256K8BMO2-45I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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5962-9315708HXX | SRAM Module, 256KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | White Electronic Designs Corp | EMS256K8BMO2-45I vs 5962-9315708HXX |
MSM4512SXLMB-35 | SRAM Module, 256KX8, 35ns, CMOS, CDIP32 | Mosaic Semiconductor Inc | EMS256K8BMO2-45I vs MSM4512SXLMB-35 |
EDI8F8257LP150BPC | SRAM Module, 256KX8, 150ns, CMOS, | Electronic Designs Inc | EMS256K8BMO2-45I vs EDI8F8257LP150BPC |
EDI8M8256LP150C6B | SRAM Module, 256KX8, 150ns, CMOS, | Electronic Designs Inc | EMS256K8BMO2-45I vs EDI8M8256LP150C6B |
EDI88257C85CI | Standard SRAM, 256KX8, 85ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | White Microelectronics | EMS256K8BMO2-45I vs EDI88257C85CI |
EDI8M8256C120B6C | SRAM Module, 256KX8, 120ns, CMOS, | Electronic Designs Inc | EMS256K8BMO2-45I vs EDI8M8256C120B6C |
MH25708TNA-85H | SRAM Module, 256KX8, 85ns, CMOS | Mitsubishi Electric | EMS256K8BMO2-45I vs MH25708TNA-85H |
DPS256S8PL-10C | SRAM Module, 256KX8, 100ns, CMOS, CDMA32, CERDIP-32 | Twilight Technology Inc | EMS256K8BMO2-45I vs DPS256S8PL-10C |
WS256K8-120CIA | SRAM Module, 256KX8, 120ns, CMOS, CDIP32, | White Microelectronics | EMS256K8BMO2-45I vs WS256K8-120CIA |
WS256K8-70CM | SRAM Module, 256KX8, 70ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | White Electronic Designs Corp | EMS256K8BMO2-45I vs WS256K8-70CM |