Datasheets
EDI88257LPA45CC by:

Standard SRAM, 256KX8, 45ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32

Part Details for EDI88257LPA45CC by Mercury Systems Inc

Overview of EDI88257LPA45CC by Mercury Systems Inc

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Applications Industrial Automation

Part Details for EDI88257LPA45CC

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EDI88257LPA45CC Part Data Attributes:

EDI88257LPA45CC Mercury Systems Inc
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EDI88257LPA45CC Mercury Systems Inc Standard SRAM, 256KX8, 45ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
Rohs Code No
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer MERCURY SYSTEMS INC
Package Description 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 45 ns
JESD-30 Code R-CDIP-T32
Length 40.64 mm
Memory Density 2097152 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 262144 words
Number of Words Code 256000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 256KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 3.937 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm

Alternate Parts for EDI88257LPA45CC

This table gives cross-reference parts and alternative options found for EDI88257LPA45CC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EDI88257LPA45CC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
EDI88257CA45CI Standard SRAM, 256KX8, 45ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Mercury Systems Inc EDI88257LPA45CC vs EDI88257CA45CI
EDI88257CA45CI Standard SRAM, 256KX8, 45ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 White Microelectronics EDI88257LPA45CC vs EDI88257CA45CI
EDI88257LPA45CI Standard SRAM, 256KX8, 45ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation EDI88257LPA45CC vs EDI88257LPA45CI
EDI88257LPA45CI Standard SRAM, 256KX8, 45ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Mercury Systems Inc EDI88257LPA45CC vs EDI88257LPA45CI
EDI88257LPA45CC Standard SRAM, 256KX8, 45ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation EDI88257LPA45CC vs EDI88257LPA45CC
EDI88257LPA45CI Standard SRAM, 256KX8, 45ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 White Microelectronics EDI88257LPA45CC vs EDI88257LPA45CI
EDI88257CA45CB Standard SRAM, 256KX8, 45ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 White Microelectronics EDI88257LPA45CC vs EDI88257CA45CB
EDI88257LPA45CB Standard SRAM, 256KX8, 45ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 White Microelectronics EDI88257LPA45CC vs EDI88257LPA45CB
EDI88257CA45CM Standard SRAM, 256KX8, 45ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Mercury Systems Inc EDI88257LPA45CC vs EDI88257CA45CM
EDI88257CA45CC Standard SRAM, 256KX8, 45ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation EDI88257LPA45CC vs EDI88257CA45CC
Part Number Description Manufacturer Compare
5962-9315708HXX SRAM Module, 256KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 White Electronic Designs Corp EDI88257LPA45CC vs 5962-9315708HXX
MSM4512SXLMB-35 SRAM Module, 256KX8, 35ns, CMOS, CDIP32 Mosaic Semiconductor Inc EDI88257LPA45CC vs MSM4512SXLMB-35
EDI8F8257LP150BPC SRAM Module, 256KX8, 150ns, CMOS, Electronic Designs Inc EDI88257LPA45CC vs EDI8F8257LP150BPC
EDI8M8256LP150C6B SRAM Module, 256KX8, 150ns, CMOS, Electronic Designs Inc EDI88257LPA45CC vs EDI8M8256LP150C6B
EDI88257C85CI Standard SRAM, 256KX8, 85ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 White Microelectronics EDI88257LPA45CC vs EDI88257C85CI
EDI8M8256C120B6C SRAM Module, 256KX8, 120ns, CMOS, Electronic Designs Inc EDI88257LPA45CC vs EDI8M8256C120B6C
MH25708TNA-85H SRAM Module, 256KX8, 85ns, CMOS Mitsubishi Electric EDI88257LPA45CC vs MH25708TNA-85H
DPS256S8PL-10C SRAM Module, 256KX8, 100ns, CMOS, CDMA32, CERDIP-32 Twilight Technology Inc EDI88257LPA45CC vs DPS256S8PL-10C
WS256K8-120CIA SRAM Module, 256KX8, 120ns, CMOS, CDIP32, White Microelectronics EDI88257LPA45CC vs WS256K8-120CIA
WS256K8-70CM SRAM Module, 256KX8, 70ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 White Electronic Designs Corp EDI88257LPA45CC vs WS256K8-70CM

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