Datasheets
EDI8F8257P100BPI by: Electronic Designs Inc

SRAM Module, 256KX8, 100ns, CMOS,

Part Details for EDI8F8257P100BPI by Electronic Designs Inc

Overview of EDI8F8257P100BPI by Electronic Designs Inc

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Part Details for EDI8F8257P100BPI

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EDI8F8257P100BPI Part Data Attributes:

EDI8F8257P100BPI Electronic Designs Inc
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EDI8F8257P100BPI Electronic Designs Inc SRAM Module, 256KX8, 100ns, CMOS,
Part Life Cycle Code Obsolete
Ihs Manufacturer ELECTRONIC DESIGNS INC
Reach Compliance Code unknown
Access Time-Max 100 ns
JESD-30 Code R-XDMA-G32
Memory Density 2097152 bit
Memory IC Type SRAM MODULE
Memory Width 8
Number of Functions 1
Number of Ports 1
Number of Terminals 32
Number of Words 262144 words
Number of Words Code 256000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 256KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material UNSPECIFIED
Package Shape RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form GULL WING
Terminal Position DUAL

Alternate Parts for EDI8F8257P100BPI

This table gives cross-reference parts and alternative options found for EDI8F8257P100BPI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EDI8F8257P100BPI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-9315708HXX SRAM Module, 256KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 White Electronic Designs Corp EDI8F8257P100BPI vs 5962-9315708HXX
MSM4512SXLMB-35 SRAM Module, 256KX8, 35ns, CMOS, CDIP32 Mosaic Semiconductor Inc EDI8F8257P100BPI vs MSM4512SXLMB-35
EDI8F8257LP150BPC SRAM Module, 256KX8, 150ns, CMOS, Electronic Designs Inc EDI8F8257P100BPI vs EDI8F8257LP150BPC
EDI8M8256LP150C6B SRAM Module, 256KX8, 150ns, CMOS, Electronic Designs Inc EDI8F8257P100BPI vs EDI8M8256LP150C6B
EDI88257C85CI Standard SRAM, 256KX8, 85ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 White Microelectronics EDI8F8257P100BPI vs EDI88257C85CI
EDI8M8256C120B6C SRAM Module, 256KX8, 120ns, CMOS, Electronic Designs Inc EDI8F8257P100BPI vs EDI8M8256C120B6C
MH25708TNA-85H SRAM Module, 256KX8, 85ns, CMOS Mitsubishi Electric EDI8F8257P100BPI vs MH25708TNA-85H
DPS256S8PL-10C SRAM Module, 256KX8, 100ns, CMOS, CDMA32, CERDIP-32 Twilight Technology Inc EDI8F8257P100BPI vs DPS256S8PL-10C
WS256K8-120CIA SRAM Module, 256KX8, 120ns, CMOS, CDIP32, White Microelectronics EDI8F8257P100BPI vs WS256K8-120CIA
WS256K8-70CM SRAM Module, 256KX8, 70ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 White Electronic Designs Corp EDI8F8257P100BPI vs WS256K8-70CM

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