Part Details for EDI8F8257P100BPI by Electronic Designs Inc
Overview of EDI8F8257P100BPI by Electronic Designs Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for EDI8F8257P100BPI
EDI8F8257P100BPI CAD Models
EDI8F8257P100BPI Part Data Attributes:
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EDI8F8257P100BPI
Electronic Designs Inc
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Datasheet
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EDI8F8257P100BPI
Electronic Designs Inc
SRAM Module, 256KX8, 100ns, CMOS,
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ELECTRONIC DESIGNS INC | |
Reach Compliance Code | unknown | |
Access Time-Max | 100 ns | |
JESD-30 Code | R-XDMA-G32 | |
Memory Density | 2097152 bit | |
Memory IC Type | SRAM MODULE | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 32 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 256KX8 | |
Output Characteristics | 3-STATE | |
Output Enable | YES | |
Package Body Material | UNSPECIFIED | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | GULL WING | |
Terminal Position | DUAL |
Alternate Parts for EDI8F8257P100BPI
This table gives cross-reference parts and alternative options found for EDI8F8257P100BPI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EDI8F8257P100BPI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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5962-9315708HXX | SRAM Module, 256KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | White Electronic Designs Corp | EDI8F8257P100BPI vs 5962-9315708HXX |
MSM4512SXLMB-35 | SRAM Module, 256KX8, 35ns, CMOS, CDIP32 | Mosaic Semiconductor Inc | EDI8F8257P100BPI vs MSM4512SXLMB-35 |
EDI8F8257LP150BPC | SRAM Module, 256KX8, 150ns, CMOS, | Electronic Designs Inc | EDI8F8257P100BPI vs EDI8F8257LP150BPC |
EDI8M8256LP150C6B | SRAM Module, 256KX8, 150ns, CMOS, | Electronic Designs Inc | EDI8F8257P100BPI vs EDI8M8256LP150C6B |
EDI88257C85CI | Standard SRAM, 256KX8, 85ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | White Microelectronics | EDI8F8257P100BPI vs EDI88257C85CI |
EDI8M8256C120B6C | SRAM Module, 256KX8, 120ns, CMOS, | Electronic Designs Inc | EDI8F8257P100BPI vs EDI8M8256C120B6C |
MH25708TNA-85H | SRAM Module, 256KX8, 85ns, CMOS | Mitsubishi Electric | EDI8F8257P100BPI vs MH25708TNA-85H |
DPS256S8PL-10C | SRAM Module, 256KX8, 100ns, CMOS, CDMA32, CERDIP-32 | Twilight Technology Inc | EDI8F8257P100BPI vs DPS256S8PL-10C |
WS256K8-120CIA | SRAM Module, 256KX8, 120ns, CMOS, CDIP32, | White Microelectronics | EDI8F8257P100BPI vs WS256K8-120CIA |
WS256K8-70CM | SRAM Module, 256KX8, 70ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | White Electronic Designs Corp | EDI8F8257P100BPI vs WS256K8-70CM |