Part Details for TSXPC740AMGB/T8LH by Atmel Corporation
Overview of TSXPC740AMGB/T8LH by Atmel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TSXPC740AMGB/T8LH
TSXPC740AMGB/T8LH CAD Models
TSXPC740AMGB/T8LH Part Data Attributes:
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TSXPC740AMGB/T8LH
Atmel Corporation
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Datasheet
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TSXPC740AMGB/T8LH
Atmel Corporation
RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ATMEL CORP | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 255 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 83.3 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-B255 | |
Length | 21 mm | |
Low Power Mode | YES | |
Number of Terminals | 255 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Screening Level | MIL-STD-883 | |
Seated Height-Max | 3 mm | |
Speed | 200 MHz | |
Supply Voltage-Max | 2.7 V | |
Supply Voltage-Min | 2.5 V | |
Supply Voltage-Nom | 2.6 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 21 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSXPC740AMGB/T8LH
This table gives cross-reference parts and alternative options found for TSXPC740AMGB/T8LH. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSXPC740AMGB/T8LH, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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TSPC740AMGU8LH | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, CERAMIC, BGA-255 | Thales Group | TSXPC740AMGB/T8LH vs TSPC740AMGU8LH |
TSPC740AMGU/T8LH | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, CERAMIC, BGA-255 | Thales Group | TSXPC740AMGB/T8LH vs TSPC740AMGU/T8LH |
TSPC740AVG8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, CERAMIC, BGA-255 | Thales Group | TSXPC740AMGB/T8LH vs TSPC740AVG8LE |
MPC740ARX200TX | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Motorola Semiconductor Products | TSXPC740AMGB/T8LH vs MPC740ARX200TX |
TSXPC740AVGU/T8LH | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | TSXPC740AMGB/T8LH vs TSXPC740AVGU/T8LH |
TSPC740AVGB/Q8LH | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, CERAMIC, BGA-255 | Thales Group | TSXPC740AMGB/T8LH vs TSPC740AVGB/Q8LH |
TSXPC740AVGB/T8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | TSXPC740AMGB/T8LH vs TSXPC740AVGB/T8LE |
TSPC740AVGU8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, CERAMIC, BGA-255 | Thales Group | TSXPC740AMGB/T8LH vs TSPC740AVGU8LE |
TSPC740AMGU/T8LH | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | TSXPC740AMGB/T8LH vs TSPC740AMGU/T8LH |
TSPC740AMGB/Q8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, CERAMIC, BGA-255 | Thales Group | TSXPC740AMGB/T8LH vs TSPC740AMGB/Q8LE |