Part Details for TSXPC740AMG8LE by e2v technologies
Overview of TSXPC740AMG8LE by e2v technologies
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Part Details for TSXPC740AMG8LE
TSXPC740AMG8LE CAD Models
TSXPC740AMG8LE Part Data Attributes:
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TSXPC740AMG8LE
e2v technologies
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Datasheet
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TSXPC740AMG8LE
e2v technologies
RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ATMEL GRENOBLE | |
Part Package Code | BGA | |
Package Description | , | |
Pin Count | 360 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 83.3 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-B360 | |
Low Power Mode | YES | |
Number of Terminals | 360 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Speed | 200 MHz | |
Supply Voltage-Max | 2.7 V | |
Supply Voltage-Min | 2.5 V | |
Supply Voltage-Nom | 2.6 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSXPC740AMG8LE
This table gives cross-reference parts and alternative options found for TSXPC740AMG8LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSXPC740AMG8LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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TSPC740AMGU8LH | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, CERAMIC, BGA-255 | Thales Group | TSXPC740AMG8LE vs TSPC740AMGU8LH |
TSPC740AMGU/T8LH | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, CERAMIC, BGA-255 | Thales Group | TSXPC740AMG8LE vs TSPC740AMGU/T8LH |
TSPC740AVG8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, CERAMIC, BGA-255 | Thales Group | TSXPC740AMG8LE vs TSPC740AVG8LE |
MPC740ARX200TX | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Motorola Semiconductor Products | TSXPC740AMG8LE vs MPC740ARX200TX |
TSXPC740AVGU/T8LH | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | TSXPC740AMG8LE vs TSXPC740AVGU/T8LH |
TSPC740AVGB/Q8LH | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, CERAMIC, BGA-255 | Thales Group | TSXPC740AMG8LE vs TSPC740AVGB/Q8LH |
TSXPC740AVGB/T8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | TSXPC740AMG8LE vs TSXPC740AVGB/T8LE |
TSPC740AVGU8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, CERAMIC, BGA-255 | Thales Group | TSXPC740AMG8LE vs TSPC740AVGU8LE |
TSPC740AMGU/T8LH | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | TSXPC740AMG8LE vs TSPC740AMGU/T8LH |
TSPC740AMGB/Q8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, CERAMIC, BGA-255 | Thales Group | TSXPC740AMG8LE vs TSPC740AMGB/Q8LE |