Part Details for 70V7339S166BCGI by Integrated Device Technology Inc
Overview of 70V7339S166BCGI by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (4 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for 70V7339S166BCGI
70V7339S166BCGI CAD Models
70V7339S166BCGI Part Data Attributes:
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70V7339S166BCGI
Integrated Device Technology Inc
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Datasheet
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70V7339S166BCGI
Integrated Device Technology Inc
CABGA-256, Tray
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | CABGA | |
| Package Description | 17 X 17 MM, 1.4 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 | |
| Pin Count | 256 | |
| Manufacturer Package Code | BCG256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 3.6 ns | |
| Additional Feature | PIPELINED ARCHITECTURE OR FLOW-THROUGH | |
| Clock Frequency-Max (fCLK) | 166 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Memory Density | 9437184 bit | |
| Memory IC Type | MULTI-PORT SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 2 | |
| Number of Terminals | 256 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512KX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Current-Max | 0.04 A | |
| Standby Voltage-Min | 3.15 V | |
| Supply Current-Max | 0.83 mA | |
| Supply Voltage-Max (Vsup) | 3.45 V | |
| Supply Voltage-Min (Vsup) | 3.15 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 17 mm |
Alternate Parts for 70V7339S166BCGI
This table gives cross-reference parts and alternative options found for 70V7339S166BCGI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70V7339S166BCGI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 70V7339S166BCI | 512K x 18 Synchronous Bank-Switchable Dual-Port SRAM, CABGA90/Tray | Renesas Electronics Corporation | 70V7339S166BCGI vs 70V7339S166BCI |
| IDT70V7339S166BCI8 | Dual-Port SRAM, 512KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | 70V7339S166BCGI vs IDT70V7339S166BCI8 |
| IDT70V7339S166BCI | Dual-Port SRAM, 512KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | 70V7339S166BCGI vs IDT70V7339S166BCI |
| 70V7339S166BCI8 | 512K x 18 Synchronous Bank-Switchable Dual-Port SRAM, CABGA0/Reel | Renesas Electronics Corporation | 70V7339S166BCGI vs 70V7339S166BCI8 |