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70V7339S166BCGI
Integrated Device Technology Inc
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$118.5442 | Yes | Yes | Transferred | 9.4372 Mbit | 18 | 512KX18 | 3.3 V | 3.6 ns | 166 MHz | MULTI-PORT SRAM | PIPELINED ARCHITECTURE OR FLOW-THROUGH | COMMON | 1 | 2 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | SERIAL | 40 mA | 3.15 V | 830 µA | 3.45 V | 3.15 V | CMOS | INDUSTRIAL | S-PBGA-B256 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 17 mm | 17 mm | INTEGRATED DEVICE TECHNOLOGY INC | CABGA | 17 X 17 MM, 1.4 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 | 256 | BCG256 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
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70V7339S166BCGI8
Integrated Device Technology Inc
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Check for Price | Transferred | 9.4372 Mbit | 18 | 512KX18 | 3.3 V | 3.6 ns | MULTI-PORT SRAM | PIPELINED ARCHITECTURE OR FLOW-THROUGH | 1 | 512000 | 524.288 k | SYNCHRONOUS | SERIAL | 3.45 V | 3.15 V | CMOS | INDUSTRIAL | S-PBGA-B256 | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 17 mm | 17 mm | INTEGRATED DEVICE TECHNOLOGY INC | LBGA, | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||||||||||||
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IDT70V7339S166BCGI8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 9.4372 Mbit | 18 | 512KX18 | 3.3 V | 12 ns | MULTI-PORT SRAM | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 1 | 512000 | 524.288 k | SYNCHRONOUS | PARALLEL | 3.45 V | 3.15 V | CMOS | INDUSTRIAL | S-PBGA-B256 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.5 mm | 17 mm | 17 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | LBGA, | 256 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||||
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IDT70V7339S166BCGI
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 9.4372 Mbit | 18 | 512KX18 | 3.3 V | 12 ns | MULTI-PORT SRAM | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 1 | 512000 | 524.288 k | SYNCHRONOUS | PARALLEL | 3.45 V | 3.15 V | CMOS | INDUSTRIAL | S-PBGA-B256 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 256 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.5 mm | 17 mm | 17 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | LBGA, | 256 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||
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70V7339S166BCGI
Renesas Electronics Corporation
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Check for Price | Yes | Yes | End Of Life | 9.4372 Mbit | 18 | 512KX18 | 3.3 V | 3.6 ns | 166 MHz | MULTI-PORT SRAM | PIPELINED ARCHITECTURE OR FLOW-THROUGH | COMMON | 1 | 2 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | SERIAL | 40 mA | 3.15 V | 830 µA | 3.45 V | 3.15 V | CMOS | INDUSTRIAL | S-PBGA-B256 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 17 mm | 17 mm | RENESAS ELECTRONICS CORP | CABGA | 256 | BCG256 | compliant | NLR | 8542320041 | Renesas Electronics |