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T8100A--BAL3-DB
LSI Corporation
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Check for Price | No | Transferred | 3.3 V | TIME SLOT ASSIGNER | 1 | INDUSTRIAL | S-PBGA-B217 | Not Qualified | 85 °C | -40 °C | 217 | PLASTIC/EPOXY | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | LUCENT TECHNOLOGIES INC | BGA | , | 217 | unknown | 8542.39.00.01 | |||||||||||||||||||
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T8100C
TE Connectivity
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Check for Price | Transferred | 2.5 GHz | 2.3 GHz | 85 °C | -54 °C | TYCO ELECTRONICS M/A-COM | unknown | 0.5 dB | 3 PORT CIRCULATOR | 1.25 | ||||||||||||||||||||||||||||||||
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L-T-8100A--SC4-DB
Avago Technologies
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Check for Price | Yes | Active | 3.3 V | TIME SLOT ASSIGNER | 1 | 275 mA | COMMERCIAL | S-PQFP-G208 | e6 | Not Qualified | 70 °C | 208 | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | YES | TIN BISMUTH | GULL WING | 500 µm | QUAD | 28 mm | 28 mm | 4.1 mm | AVAGO TECHNOLOGIES INC | FQFP, QFP208,1.2SQ,20 | compliant | 8542.39.00.01 | |||||||||||||
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L-T-8100A--SC4-DB
Broadcom Limited
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Check for Price | Yes | Active | 3.3 V | TIME SLOT ASSIGNER | 1 | 275 mA | COMMERCIAL | S-PQFP-G208 | e6 | Not Qualified | 70 °C | 208 | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | YES | TIN BISMUTH | GULL WING | 500 µm | QUAD | 28 mm | 28 mm | 4.1 mm | BROADCOM LTD | FQFP, QFP208,1.2SQ,20 | compliant | 8542.39.00.01 | |||||||||||||
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T8100A--BAL3-DB
Broadcom Limited
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Check for Price | Active | 3.3 V | TIME SLOT ASSIGNER | 1 | 275 mA | INDUSTRIAL | S-PBGA-B217 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 217 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 23 mm | 23 mm | 2.32 mm | BROADCOM INC | PLASTIC, BGA-217 | compliant | 8542.39.00.01 | ||||||||||||
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L-T-8100A--BAL4-DB
Broadcom Limited
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Check for Price | Yes | Active | 3.3 V | TIME SLOT ASSIGNER | 1 | 275 mA | INDUSTRIAL | S-PBGA-B217 | e1 | Not Qualified | 85 °C | -40 °C | 217 | PLASTIC/EPOXY | BGA | BGA217,17X17,50 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 23 mm | 23 mm | 2.32 mm | BROADCOM LTD | BGA, BGA217,17X17,50 | compliant | 8542.39.00.01 | ||||||||||||
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T8100---BAL
LSI Corporation
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Check for Price | No | No | Transferred | 3.3 V | TIME SLOT ASSIGNER | 1 | INDUSTRIAL | S-PBGA-B217 | e0 | Not Qualified | 85 °C | -40 °C | 217 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 23 mm | 23 mm | 2.13 mm | LSI CORP | BGA | BGA, | 217 | compliant | 8542.39.00.01 | |||||||||||
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T8100A--SC3-DB
LSI Corporation
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Check for Price | No | No | Transferred | 3.3 V | TIME SLOT ASSIGNER | 1 | COMMERCIAL | S-PQFP-G208 | e0 | Not Qualified | 70 °C | 208 | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | YES | TIN LEAD | GULL WING | 500 µm | QUAD | 28 mm | 28 mm | 4.1 mm | LSI CORP | QFP | FQFP, | 208 | compliant | 8542.39.00.01 | ||||||||||||
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T8100A--BAL4-DB
LSI Corporation
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Check for Price | No | No | Contact Manufacturer | 3.3 V | TIME SLOT ASSIGNER | 1 | INDUSTRIAL | S-PBGA-B217 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 217 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 23 mm | 23 mm | 2.32 mm | LSI CORP | BGA | PLASTIC, BGA-217 | 217 | compliant | ||||||||||
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T8100A(208SQFP)
LSI Corporation
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Check for Price | Obsolete | AGERE SYSTEMS INC | , | unknown |