Parametric results for: Other Telecom ICs

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Sorted By: Supply Voltage-Nom
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80HCPS1848CHMG
Renesas Electronics Corporation
Check for Price Yes Yes Active 1 V PACKET ROUTING SWITCH 1 S-PBGA-B784 e1 4 70 °C 250 784 PLASTIC/EPOXY HBGA BGA784,28X28,40 SQUARE GRID ARRAY, HEAT SINK/SLUG YES TIN SILVER COPPER BALL 1 mm BOTTOM 29 mm 29 mm 2.83 mm RENESAS ELECTRONICS CORP FCBGA 784 HMG784 compliant NLR 8542390001 Renesas Electronics
DA14580-01UNA
Dialog Semiconductor GmbH
$2.3197 Yes Obsolete 1 V TELECOM CIRCUIT 1 INDUSTRIAL S-PBGA-B34 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 34 PLASTIC/EPOXY VFBGA SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 400 µm BOTTOM 2.436 mm 2.436 mm 551 µm DIALOG SEMICONDUCTOR GMBH compliant EAR99 8542.39.00.01 Dialog Semiconductor WLSCP-34
80HCPS1848CHMGI
Renesas Electronics Corporation
Check for Price Yes Yes Active 1 V PACKET ROUTING SWITCH 1 S-PBGA-B784 e1 4 85 °C -40 °C 250 784 PLASTIC/EPOXY HBGA BGA784,28X28,40 SQUARE GRID ARRAY, HEAT SINK/SLUG YES TIN SILVER COPPER BALL 1 mm BOTTOM 29 mm 29 mm 2.83 mm RENESAS ELECTRONICS CORP FCBGA 784 HMG784 compliant NLR 8542390001 Renesas Electronics
80HCPS1432HMG
Integrated Device Technology Inc
Check for Price Yes Transferred 1 V TELECOM CIRCUIT 1 COMMERCIAL S-PBGA-B576 70 °C 576 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES BALL 1 mm BOTTOM 25 mm 25 mm 2.83 mm INTEGRATED DEVICE TECHNOLOGY INC compliant 8542.39.00.01 BGA, 2016-04-04
80HCPS1848RMI
Integrated Device Technology Inc
Check for Price No Yes Obsolete 1 V TELECOM CIRCUIT 1 INDUSTRIAL S-PBGA-B784 e1 4 85 °C -40 °C 250 30 784 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 1 mm BOTTOM 29 mm 29 mm 2.83 mm INTEGRATED DEVICE TECHNOLOGY INC FCBGA 784 RM784 not_compliant EAR99 8542.39.00.01 FCBGA-784
80HCPS1848CBR
Integrated Device Technology Inc
Check for Price No Yes Obsolete 1 V TELECOM CIRCUIT 1 7.94 A COMMERCIAL S-PBGA-B784 e1 Not Qualified 4 70 °C 245 784 PLASTIC/EPOXY BGA BGA784,28X28,40 SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 1 mm BOTTOM 29 mm 29 mm 3.44 mm INTEGRATED DEVICE TECHNOLOGY INC FCBGA 784 BR784H1 compliant 8542.39.00.01 FCBGA-784
80HCPS1616CHRI
Integrated Device Technology Inc
Check for Price No Yes Obsolete 1 V TELECOM CIRCUIT 1 4.73 A INDUSTRIAL S-PBGA-B400 e1 Not Qualified 4 85 °C -40 °C 245 400 PLASTIC/EPOXY BGA BGA400,20X20,40 SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 1 mm BOTTOM 21 mm 21 mm 3.34 mm INTEGRATED DEVICE TECHNOLOGY INC FCBGA 400 HR400 compliant EAR99 8542.39.00.01 FCBGA-400
VSC8541WZBRT-SV
Microchip Technology Inc
Check for Price Active 1 V 1 1 Tbps ETHERNET TRANSCEIVER 1 MILITARY S-CQFP-F68 125 °C -55 °C MIL-PRF-38535 Class V 100k Rad(Si) V 68 CERAMIC, METAL-SEALED COFIRED HGQFF TPAK68,2.5SQ,25 SQUARE FLATPACK, HEAT SINK/SLUG, GUARD RING YES FLAT 635 µm QUAD 13.05 mm 13.05 mm 3.91 mm MICROCHIP TECHNOLOGY INC compliant 3A001.A.2.A 8542.39.00.01 HGQFF, TPAK68,2.5SQ,25
80HCPS1848BLGI
Integrated Device Technology Inc
Check for Price Yes Transferred 1 V 240 Tbps TELECOM CIRCUIT 1 INDUSTRIAL S-PBGA-B784 85 °C -40 °C 784 PLASTIC/EPOXY BGA BGA784,28X28,40 SQUARE GRID ARRAY YES BALL 1 mm BOTTOM 29 mm 29 mm 3.44 mm INTEGRATED DEVICE TECHNOLOGY INC compliant 8542.39.00.01 BGA, BGA784,28X28,40 2016-04-04
VSC8491YJU-11
Microchip Technology Inc
Check for Price Active 1 V TELECOM CIRCUIT 1 INDUSTRIAL S-PBGA-B196 110 °C -40 °C 196 PLASTIC/EPOXY LBGA SQUARE GRID ARRAY, LOW PROFILE YES BALL 1 mm BOTTOM 15 mm 15 mm 1.4 mm MICROCHIP TECHNOLOGY INC compliant 8542.39.00.01 FCBGA-196