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31 - 40 of 45,137 results
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80HCPS1848CHMG
Renesas Electronics Corporation
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Check for Price | Yes | Yes | Active | 1 V | PACKET ROUTING SWITCH | 1 | S-PBGA-B784 | e1 | 4 | 70 °C | 250 | 784 | PLASTIC/EPOXY | HBGA | BGA784,28X28,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 29 mm | 29 mm | 2.83 mm | RENESAS ELECTRONICS CORP | FCBGA | 784 | HMG784 | compliant | NLR | 8542390001 | Renesas Electronics | |||||||||||||
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DA14580-01UNA
Dialog Semiconductor GmbH
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$2.3197 | Yes | Obsolete | 1 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B34 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 34 | PLASTIC/EPOXY | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 400 µm | BOTTOM | 2.436 mm | 2.436 mm | 551 µm | DIALOG SEMICONDUCTOR GMBH | compliant | EAR99 | 8542.39.00.01 | Dialog Semiconductor | WLSCP-34 | |||||||||||||||||
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80HCPS1848CHMGI
Renesas Electronics Corporation
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Check for Price | Yes | Yes | Active | 1 V | PACKET ROUTING SWITCH | 1 | S-PBGA-B784 | e1 | 4 | 85 °C | -40 °C | 250 | 784 | PLASTIC/EPOXY | HBGA | BGA784,28X28,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 29 mm | 29 mm | 2.83 mm | RENESAS ELECTRONICS CORP | FCBGA | 784 | HMG784 | compliant | NLR | 8542390001 | Renesas Electronics | ||||||||||||
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80HCPS1432HMG
Integrated Device Technology Inc
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Check for Price | Yes | Transferred | 1 V | TELECOM CIRCUIT | 1 | COMMERCIAL | S-PBGA-B576 | 70 °C | 576 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 25 mm | 25 mm | 2.83 mm | INTEGRATED DEVICE TECHNOLOGY INC | compliant | 8542.39.00.01 | BGA, | 2016-04-04 | |||||||||||||||||||||
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80HCPS1848RMI
Integrated Device Technology Inc
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Check for Price | No | Yes | Obsolete | 1 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B784 | e1 | 4 | 85 °C | -40 °C | 250 | 30 | 784 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 29 mm | 29 mm | 2.83 mm | INTEGRATED DEVICE TECHNOLOGY INC | FCBGA | 784 | RM784 | not_compliant | EAR99 | 8542.39.00.01 | FCBGA-784 | |||||||||||
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80HCPS1848CBR
Integrated Device Technology Inc
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Check for Price | No | Yes | Obsolete | 1 V | TELECOM CIRCUIT | 1 | 7.94 A | COMMERCIAL | S-PBGA-B784 | e1 | Not Qualified | 4 | 70 °C | 245 | 784 | PLASTIC/EPOXY | BGA | BGA784,28X28,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 29 mm | 29 mm | 3.44 mm | INTEGRATED DEVICE TECHNOLOGY INC | FCBGA | 784 | BR784H1 | compliant | 8542.39.00.01 | FCBGA-784 | |||||||||||
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80HCPS1616CHRI
Integrated Device Technology Inc
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Check for Price | No | Yes | Obsolete | 1 V | TELECOM CIRCUIT | 1 | 4.73 A | INDUSTRIAL | S-PBGA-B400 | e1 | Not Qualified | 4 | 85 °C | -40 °C | 245 | 400 | PLASTIC/EPOXY | BGA | BGA400,20X20,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 21 mm | 21 mm | 3.34 mm | INTEGRATED DEVICE TECHNOLOGY INC | FCBGA | 400 | HR400 | compliant | EAR99 | 8542.39.00.01 | FCBGA-400 | |||||||||
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VSC8541WZBRT-SV
Microchip Technology Inc
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Check for Price | Active | 1 V | 1 | 1 Tbps | ETHERNET TRANSCEIVER | 1 | MILITARY | S-CQFP-F68 | 125 °C | -55 °C | MIL-PRF-38535 Class V | 100k Rad(Si) V | 68 | CERAMIC, METAL-SEALED COFIRED | HGQFF | TPAK68,2.5SQ,25 | SQUARE | FLATPACK, HEAT SINK/SLUG, GUARD RING | YES | FLAT | 635 µm | QUAD | 13.05 mm | 13.05 mm | 3.91 mm | MICROCHIP TECHNOLOGY INC | compliant | 3A001.A.2.A | 8542.39.00.01 | HGQFF, TPAK68,2.5SQ,25 | ||||||||||||||||
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80HCPS1848BLGI
Integrated Device Technology Inc
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Check for Price | Yes | Transferred | 1 V | 240 Tbps | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B784 | 85 °C | -40 °C | 784 | PLASTIC/EPOXY | BGA | BGA784,28X28,40 | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 29 mm | 29 mm | 3.44 mm | INTEGRATED DEVICE TECHNOLOGY INC | compliant | 8542.39.00.01 | BGA, BGA784,28X28,40 | 2016-04-04 | ||||||||||||||||||
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VSC8491YJU-11
Microchip Technology Inc
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Check for Price | Active | 1 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B196 | 110 °C | -40 °C | 196 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 15 mm | 15 mm | 1.4 mm | MICROCHIP TECHNOLOGY INC | compliant | 8542.39.00.01 | FCBGA-196 |