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80HCPS1848BLG
Integrated Device Technology Inc
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Check for Price | Yes | Transferred | 1 V | 240 Tbps | TELECOM CIRCUIT | 1 | COMMERCIAL | S-PBGA-B784 | 70 °C | 784 | PLASTIC/EPOXY | BGA | BGA784,28X28,40 | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 29 mm | 29 mm | 3.44 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA, BGA784,28X28,40 | compliant | 8542.39.00.01 | 2016-04-04 | |||||||||||||||
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80HCPS1848BLGI
Integrated Device Technology Inc
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Check for Price | Yes | Transferred | 1 V | 240 Tbps | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B784 | 85 °C | -40 °C | 784 | PLASTIC/EPOXY | BGA | BGA784,28X28,40 | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 29 mm | 29 mm | 3.44 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA, BGA784,28X28,40 | compliant | 8542.39.00.01 | 2016-04-04 | ||||||||||||||
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SMI10021
Semtech Corporation
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Check for Price | End Of Life | 1.2 V | 113 Tbps | TELECOM CIRCUIT | IT ALSO OPERATES AT 1.5 V AND 2.8 V NOMINAL SUPPLY VOLTAGE | 1 | R-PBGA-B | PLASTIC/EPOXY | RECTANGULAR | YES | BALL | BOTTOM | SEMTECH CORP | , | unknown | 8542.39.00.01 | ||||||||||||||||||||||||||
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80HCPS1616CHMGI
Renesas Electronics Corporation
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Check for Price | Yes | Yes | Active | 1 V | 80 Tbps | TELECOM CIRCUIT | 1 | S-PBGA-B400 | 4 | 85 °C | -40 °C | 245 | 400 | PLASTIC/EPOXY | HBGA | BGA400,20X20,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 21 mm | 21 mm | 2.83 mm | RENESAS ELECTRONICS CORP | compliant | 8542390001 | FCBGA | 400 | HMG400 | NLR | Renesas Electronics | ||||||||
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AFE8092IABJ
Texas Instruments
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Check for Price | Yes | Yes | Active | 32.5 Tbps | TELECOM CIRCUIT | RF frequency(Min)(MHz) : 600, RF frequency(Max)(MHz) : 5500 | 1 | INDUSTRIAL | S-PBGA-B400 | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 400 | PLASTIC/EPOXY | FBGA | BGA400,20X20,32 | SQUARE | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 17 mm | 17 mm | 2.65 mm | TEXAS INSTRUMENTS INC | FCBGA-400 | compliant | ||||||||||
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AFE8092HIABJ
Texas Instruments
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Check for Price | Yes | Yes | Active | 32.5 Tbps | TELECOM CIRCUIT | RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500 | 1 | S-PBGA-B400 | e1 | 3 | 85 °C | -40 °C | 260 | 400 | PLASTIC/EPOXY | FBGA | BGA400,20X20,32 | SQUARE | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 17 mm | 17 mm | 2.65 mm | TEXAS INSTRUMENTS INC | FCBGA-400 | compliant | ||||||||||||
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AFE8000IABJ
Texas Instruments
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Check for Price | Yes | Yes | Active | 32.5 Tbps | TELECOM CIRCUIT | RF frequency(Max)(MHz) : 7000 | 1 | S-PBGA-B400 | e1 | 3 | 85 °C | -40 °C | 260 | 400 | PLASTIC/EPOXY | FBGA | BGA400,20X20,32 | SQUARE | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 17 mm | 17 mm | 2.65 mm | TEXAS INSTRUMENTS INC | FCBGA-400 | compliant | ||||||||||||
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GX62474-HIU
Integrated Device Technology Inc
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Check for Price | No | Transferred | 32 Tbps | TELECOM CIRCUIT | 1 | OTHER | 85 °C | -5 °C | UNSPECIFIED | RECTANGULAR | INTEGRATED DEVICE TECHNOLOGY INC | SMD | compliant | 8542.33.00.01 | 2019-12-17 | MODULE | 0 | MOD0 | 5A991.B.1 | |||||||||||||||||||||||
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GX62474-HIU
Renesas Electronics Corporation
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Check for Price | No | Obsolete | 32 Tbps | TELECOM CIRCUIT | 1 | OTHER | 85 °C | -5 °C | UNSPECIFIED | RECTANGULAR | RENESAS ELECTRONICS CORP | SMD | compliant | 8542330001 | MODULE | 0 | MOD0 | NLR | Renesas Electronics | |||||||||||||||||||||||
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AFE7901IABJ
Texas Instruments
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Check for Price | Yes | Yes | Active | 925 mV | 29.5 Tbps | TELECOM CIRCUIT | 1 | S-PBGA-B400 | e1 | 3 | 85 °C | -40 °C | 260 | 400 | PLASTIC/EPOXY | FBGA | BGA400,20X20,32 | SQUARE | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 17 mm | 17 mm | 2.65 mm | TEXAS INSTRUMENTS INC | FCBGA-400 | compliant | 8542.39.00.01 | 5A991.B |