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41 - 50 of 45,137 results
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ADRV9002BBCZ
Analog Devices Inc
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$492.5732 | No | Yes | Active | 1 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B196 | 3 | 110 °C | -40 °C | 260 | 30 | 196 | PLASTIC/EPOXY | TFBGA | BGA196,14X14,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 12 mm | 12 mm | 1.19 mm | ANALOG DEVICES INC | 196 | BC-196-16 | compliant | Analog Devices | ||||||||||||
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VSC7426XJG-02
Microchip Technology Inc
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$70.2452 | Active | 1 V | ETHERNET SWITCH | 1 | 2.7 A | OTHER | S-PBGA-B672 | 125 °C | 672 | PLASTIC/EPOXY | HBGA | BGA672,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | YES | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | 2.44 mm | MICROCHIP TECHNOLOGY INC | compliant | Microchip | BGA-672 | 5A991.C | 8542.39.00.01 | ||||||||||||||||
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80HCPS1848HM
Renesas Electronics Corporation
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Check for Price | No | No | Obsolete | 1 V | PACKET ROUTING SWITCH | 1 | S-PBGA-B784 | e0 | 4 | 70 °C | 225 | 784 | PLASTIC/EPOXY | HBGA | BGA784,28X28,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 29 mm | 29 mm | 2.83 mm | RENESAS ELECTRONICS CORP | 784 | HM784 | compliant | Renesas Electronics | NLR | 8542390000 | FCBGA | ||||||||||
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80HCPS1616RMI
Renesas Electronics Corporation
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$323.1221 | No | Not Recommended | 1 V | TELECOM CIRCUIT | 1 | 4.73 A | INDUSTRIAL | S-PBGA-B400 | e1 | Not Qualified | 4 | 85 °C | -40 °C | 245 | 400 | PLASTIC/EPOXY | BGA | BGA400,20X20,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 21 mm | 21 mm | 2.83 mm | 400 | RM400 | Renesas Electronics | NLR | 8542390001 | FCBGA | |||||||||
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F6212AVGI8
Renesas Electronics Corporation
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Check for Price | Yes | Yes | Active | 1 V | TELECOM CIRCUIT | ALSO AVAILABLE WITH 2.3V NOMINAL SUPPLY | 1 | S-PBGA-B165 | e3 | 3 | 85 °C | -40 °C | 260 | 165 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN | BOTTOM | RENESAS ELECTRONICS CORP | 165 | AVG165D1 | compliant | Renesas Electronics | NLR | 8542390001 | FCCSP | ||||||||||||||
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AD9172BBPZRL
Analog Devices Inc
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Check for Price | No | Yes | Active | 1 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B144 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 144 | PLASTIC/EPOXY | FBGA | SQUARE | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 10 mm | 10 mm | 1.71 mm | ANALOG DEVICES INC | 144 | BP-144-1 | compliant | Analog Devices | CSBGA-144 | 3A001.A.5.B.2.A | 8542.39.00.01 | 2017-06-30 | ||||||||||
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80HCPS1848CBLG
Renesas Electronics Corporation
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Check for Price | Yes | Yes | Active | 1 V | PACKET ROUTING SWITCH | 1 | S-PBGA-B784 | e1 | 4 | 70 °C | 245 | 784 | PLASTIC/EPOXY | BGA | BGA784,28X28,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 29 mm | 29 mm | 3.44 mm | RENESAS ELECTRONICS CORP | 784 | BLG784 | compliant | Renesas Electronics | NLR | 8542390001 | FCBGA | ||||||||||
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DA14580-01AT2
Dialog Semiconductor GmbH
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$2.0978 | Yes | Obsolete | 1 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N40 | 85 °C | -40 °C | 40 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 400 µm | QUAD | 5 mm | 5 mm | 900 µm | DIALOG SEMICONDUCTOR GMBH | compliant | Dialog Semiconductor | QFN-40 | EAR99 | 8542.39.00.01 | ||||||||||||||||
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80HCPS1848CBRI
Integrated Device Technology Inc
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Check for Price | No | Yes | Obsolete | 1 V | TELECOM CIRCUIT | 1 | 7.94 A | INDUSTRIAL | S-PBGA-B784 | e1 | Not Qualified | 4 | 85 °C | -40 °C | 245 | 784 | PLASTIC/EPOXY | BGA | BGA784,28X28,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 29 mm | 29 mm | 3.44 mm | INTEGRATED DEVICE TECHNOLOGY INC | 784 | BR784H1 | compliant | FCBGA-784 | 8542.39.00.01 | FCBGA | |||||||
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VSC7437XMT
Microchip Technology Inc
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$135.5853 | Active | 1 V | ETHERNET SWITCH | 1 | S-PBGA-B324 | 125 °C | -40 °C | 324 | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | GRID ARRAY | YES | BALL | 400 µm | BOTTOM | 19 mm | 19 mm | 1.8 mm | MICROCHIP TECHNOLOGY INC | compliant | Microchip | BGA-324 | 8542.39.00.01 |