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21 - 30 of 45,137 results
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DA14582-01KA1
Dialog Semiconductor GmbH
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Check for Price | Yes | Obsolete | 1 V | TELECOM CIRCUIT | 1 | OTHER | S-XQCC-N56 | 3 | 60 °C | -20 °C | 56 | UNSPECIFIED | VQCCN | SQUARE | CHIP CARRIER, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 8 mm | 8 mm | 680 µm | DIALOG SEMICONDUCTOR GMBH | QFN-56 | unknown | EAR99 | 8542.39.00.01 | ||||||||||||||||
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80HCPS1848HM
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 1 V | TELECOM CIRCUIT | 1 | COMMERCIAL | S-PBGA-B784 | e0 | 4 | 70 °C | 225 | 784 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 29 mm | 29 mm | 2.83 mm | INTEGRATED DEVICE TECHNOLOGY INC | FCBGA-784 | not_compliant | 8542.39.00.01 | FCBGA | 784 | HM784 | |||||||||||
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DA14580-01WO4
Dialog Semiconductor GmbH
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Check for Price | Yes | Obsolete | 1 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | X-XUUC-N | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | UNSPECIFIED | DIE | UNSPECIFIED | UNCASED CHIP | YES | NO LEAD | UPPER | DIALOG SEMICONDUCTOR GMBH | WAFER | unknown | EAR99 | 8542.39.00.01 | ||||||||||||||||||||
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80HCPS1848BLG
Integrated Device Technology Inc
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Check for Price | Yes | Transferred | 1 V | 240 Tbps | TELECOM CIRCUIT | 1 | COMMERCIAL | S-PBGA-B784 | 70 °C | 784 | PLASTIC/EPOXY | BGA | BGA784,28X28,40 | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 29 mm | 29 mm | 3.44 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA, BGA784,28X28,40 | compliant | 8542.39.00.01 | 2016-04-04 | ||||||||||||||||
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80HCPS1432RMI
Integrated Device Technology Inc
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Check for Price | No | Yes | Obsolete | 1 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B576 | e1 | 4 | 85 °C | -40 °C | 245 | 30 | 576 | PLASTIC/EPOXY | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 25 mm | 25 mm | 2.83 mm | INTEGRATED DEVICE TECHNOLOGY INC | 25 X 25 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-576 | not_compliant | 8542.39.00.01 | FCBGA | 576 | RM576 | |||||||||
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VSC7415XMT
Microchip Technology Inc
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$61.3175 | Active | 1 V | ETHERNET SWITCH | ESD VALUE FOR CLKOUTPLL2_N and CLKOUTPLL2_P PINS IS 1C | 1 | 3.3 A | S-PBGA-B324 | 125 °C | -40 °C | 324 | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 1.8 mm | MICROCHIP TECHNOLOGY INC | BGA-324 | compliant | 5A991.C | 8542.39.00.01 | ||||||||||||||||
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80HCPS1848RM
Integrated Device Technology Inc
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Check for Price | No | Yes | Obsolete | 1 V | TELECOM CIRCUIT | 1 | COMMERCIAL | S-PBGA-B784 | e1 | 4 | 70 °C | 250 | 30 | 784 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 29 mm | 29 mm | 2.83 mm | INTEGRATED DEVICE TECHNOLOGY INC | FCBGA-784 | not_compliant | EAR99 | 8542.39.00.01 | FCBGA | 784 | RM784 | |||||||||
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80HCPS1432CRMI
Integrated Device Technology Inc
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Check for Price | No | Yes | Obsolete | 1 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B576 | e1 | 4 | 85 °C | -40 °C | 245 | 30 | 576 | PLASTIC/EPOXY | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 25 mm | 25 mm | 2.83 mm | INTEGRATED DEVICE TECHNOLOGY INC | 25 X 25 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-576 | not_compliant | 8542.39.00.01 | FCBGA | 576 | RM576 | |||||||||
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80HCPS1848CHMI
Renesas Electronics Corporation
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Check for Price | No | No | Obsolete | 1 V | PACKET ROUTING SWITCH | 1 | S-PBGA-B784 | e0 | 4 | 85 °C | -40 °C | 225 | 784 | PLASTIC/EPOXY | HBGA | BGA784,28X28,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 29 mm | 29 mm | 2.83 mm | RENESAS ELECTRONICS CORP | compliant | NLR | 8542390001 | FCBGA | 784 | HM784 | Renesas Electronics | |||||||||
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VSC7424XJG-02
Microchip Technology Inc
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$51.2597 | Yes | Active | 1 V | ETHERNET SWITCH | 1 | 2 A | S-PBGA-B672 | e1 | 125 °C | -40 °C | 672 | PLASTIC/EPOXY | HBGA | BGA672,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | 2.36 mm | MICROCHIP TECHNOLOGY INC | BGA-672 | unknown | 5A991.C | 8542.39.00.01 | Microchip |