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21 - 30 of 776 results
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UAA2067G-T
NXP Semiconductors
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Check for Price | Obsolete | 3.6 V | BICMOS | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | OTHER | S-PQFP-G32 | Not Qualified | 85 °C | -30 °C | 32 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 5 mm | 5 mm | 1.6 mm | NXP SEMICONDUCTORS | LFQFP, | unknown | 8542.39.00.01 | |||||||||||||
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RY3GB040
Sharp Corp
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Check for Price | Obsolete | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | R-XXMA-X | Not Qualified | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | UNSPECIFIED | UNSPECIFIED | SHARP CORP | 42 X 33 MM, 8 MM HEIGHT, COMPACT PACKAGE-14 | unknown | |||||||||||||||||||||||||
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CXG1097EN
Sony Semiconductor
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Check for Price | Yes | Yes | Obsolete | 2.7 V | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 17 mA | OTHER | R-XDSO-N16 | e6 | Not Qualified | 85 °C | -35 °C | 260 | 10 | 16 | UNSPECIFIED | VSON | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | YES | Tin/Bismuth (Sn/Bi) | NO LEAD | 400 µm | DUAL | 2.5 mm | 3.5 mm | 900 µm | SONY CORP | VSON, | unknown | 8542.39.00.01 | SON | 16 | |||||
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MC13109FB
Motorola Mobility LLC
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Check for Price | No | Obsolete | 2.6 V | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | 12 mA | OTHER | S-PQFP-G52 | e0 | Not Qualified | 85 °C | -20 °C | 52 | PLASTIC/EPOXY | QFP | QFP52,.52SQ | SQUARE | FLATPACK | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 10 mm | 10 mm | 2.45 mm | MOTOROLA INC | QFP, QFP52,.52SQ | unknown | 8542.39.00.01 | QFP | 52 | |||||||
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U3550BM-AFLG3
Atmel Corporation
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Check for Price | Transferred | 3.6 V | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | COMMERCIAL EXTENDED | R-PDSO-G28 | Not Qualified | 75 °C | -25 °C | 28 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 7.4 mm | 17.925 mm | ATMEL CORP | SOP, | unknown | 8542.39.00.01 | SOIC | 28 | |||||||||||||
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HPMX-5002-STR
Hewlett Packard Co
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Check for Price | Transferred | 3 V | CORDLESS TELEPHONE BASEBAND CIRCUIT | 1 | 27 mA | S-PQFP-G48 | Not Qualified | 48 | PLASTIC/EPOXY | SQUARE | FLATPACK | YES | GULL WING | QUAD | HEWLETT PACKARD CO | , | unknown | 8542.39.00.01 | QFP | 48 | |||||||||||||||||||
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MSM6870-3GS-VK
OKI Electric Industry Co Ltd
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Check for Price | Obsolete | 3.6 V | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 13 mA | OTHER | R-PDSO-G32 | Not Qualified | 70 °C | -30 °C | 32 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | GULL WING | 1 mm | DUAL | 7.9 mm | 16 mm | 2.5 mm | OKI ELECTRIC INDUSTRY CO LTD | SSOP, | unknown | 8542.39.00.01 | SSOP | 32 | |||||||||||
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TRM5F-J
Mitsumi Electric Co Ltd
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Check for Price | Obsolete | 2.4 V | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | 52 mA | R-XXMA-X | Not Qualified | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | UNSPECIFIED | UNSPECIFIED | MITSUMI ELECTRIC CO LTD | , | unknown | 8542.39.00.01 | ||||||||||||||||||||||
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MC13110FB
Freescale Semiconductor
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Check for Price | No | Obsolete | 3.6 V | 3.6 V | 12 mA | INDUSTRIAL | S-PQFP-G52 | e0 | Not Qualified | 85 °C | -40 °C | 52 | PLASTIC/EPOXY | QFP | QFP52,.52SQ | SQUARE | FLATPACK | YES | Tin/Lead (Sn/Pb) | GULL WING | 635 µm | QUAD | MOTOROLA SEMICONDUCTOR PRODUCTS | QFP, QFP52,.52SQ | unknown | ||||||||||||||
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U2785B-MFSG3
Temic Semiconductors
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Check for Price | No | Transferred | 3 V | BIPOLAR | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | OTHER | R-PDSO-G28 | e0 | Not Qualified | 85 °C | -25 °C | 28 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | DUAL | TEMIC SEMICONDUCTORS | SSO-28 | unknown |