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Parametric results for: Cordless Telephone ICs

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TRM7F-J01H
 Mitsumi Electric Co Ltd 		Check for Price Obsolete 2.4 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 52 mA R-XXMA-X17 Not Qualified 17 UNSPECIFIED RECTANGULAR MICROELECTRONIC ASSEMBLY NO UNSPECIFIED UNSPECIFIED MITSUMI ELECTRIC CO LTD , unknown 8542.39.00.01
AD6190ARS
 Analog Devices Inc 		Check for Price No Obsolete 3.3 V BIPOLAR CORDLESS TELEPHONE BASEBAND CIRCUIT 1 OTHER R-PDSO-G28 e0 Not Qualified 85 °C -20 °C 28 PLASTIC/EPOXY SSOP SSOP28,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES Tin/Lead (Sn/Pb) GULL WING 650 µm DUAL 5.3 mm 10.2 mm 2 mm ANALOG DEVICES INC SSOP-28 unknown 8542.39.00.01 SSOP 28
M64026FP
 Mitsubishi Electric 		Check for Price Transferred CORDLESS TELEPHONE SCRAMBLER/DESCRAMBLER 1 R-PDSO-G16 Not Qualified 16 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 5.3 mm 10.1 mm 2.1 mm MITSUBISHI ELECTRIC CORP SOP, unknown 8542.39.00.01 SOIC 16
SC14408B80VD
 National Semiconductor Corporation 		Check for Price No Obsolete CMOS CORDLESS TELEPHONE BASEBAND CIRCUIT 1 S-PQFP-G80 e0 Not Qualified 80 PLASTIC/EPOXY QFP QFP80,.68SQ SQUARE FLATPACK YES TIN LEAD GULL WING 650 µm QUAD 14 mm 14 mm 2.35 mm NATIONAL SEMICONDUCTOR CORP QFP, QFP80,.68SQ unknown 8542.39.00.01
KS8803B
 Samsung Semiconductor 		Check for Price No Obsolete 5 V CMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 7 µA COMMERCIAL EXTENDED R-PDIP-T16 e0 Not Qualified 75 °C -30 °C 16 PLASTIC/EPOXY DIP DIP16,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 7.62 mm 19.4 mm 5.08 mm SAMSUNG SEMICONDUCTOR INC DIP, DIP16,.3 compliant 8542.39.00.01 DIP 16
MC13110AFB
 Freescale Semiconductor 		Check for Price Transferred 3.6 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 INDUSTRIAL S-PQFP-G52 Not Qualified 85 °C -40 °C 52 PLASTIC/EPOXY QFP SQUARE FLATPACK YES GULL WING 650 µm QUAD 10 mm 10 mm 2.45 mm FREESCALE SEMICONDUCTOR INC QFP, unknown 8542.39.00.01 QFP 52 EAR99
BU8241FS-T1
 ROHM Semiconductor 		Check for Price Yes Yes Active SUPPORT CIRCUIT 1 R-PDSO-G24 e3/e2 Not Qualified 260 10 24 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES TIN/TIN COPPER GULL WING 800 µm DUAL 5.4 mm 10 mm 2.01 mm ROHM CO LTD SSOP-24 unknown SSOP 24
PCD5043H
 NXP Semiconductors 		Check for Price No Obsolete 3 V CMOS CORDLESS TELEPHONE BURST MODE CONTROLLER 1 12 mA OTHER R-PQFP-G64 Not Qualified 70 °C -25 °C 64 PLASTIC/EPOXY QFP QFP64,.7X.95,40 RECTANGULAR FLATPACK YES GULL WING 1 mm QUAD 14 mm 20 mm 3.2 mm NXP SEMICONDUCTORS QFP, QFP64,.7X.95,40 unknown 8542.39.00.01
HHM0130
 TDK Corporation 		Check for Price Obsolete CORDLESS TELEPHONE SUPPORT CIRCUIT 1 COMMERCIAL R-PDMW-N6 Not Qualified 60 °C -10 °C 6 PLASTIC/EPOXY RECTANGULAR MICROWAVE YES NO LEAD DUAL TDK CORP , unknown 8542.39.00.01
KS8800D
 Samsung Semiconductor 		Check for Price No Obsolete 4.5 V CMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 15 mA OTHER R-PDSO-G18 e0 Not Qualified 70 °C -25 °C 18 PLASTIC/EPOXY SOP SOP18,.3 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL SAMSUNG SEMICONDUCTOR INC SOP, SOP18,.3 unknown 8542.39.00.01
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