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Parametric results for: Cordless Telephone ICs

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TG2403CT
 Toshiba America Electronic Components 		Check for Price Yes Yes Active 3 V GAAS CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 180 mA INDUSTRIAL R-XBCC-B20 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 20 UNSPECIFIED HVBCC RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES BUTT 500 µm BOTTOM 2.9 mm 3.9 mm 530 µm TOSHIBA CORP HVBCC, unknown 8542.39.00.01
NJG1701V
 New Japan Radio Co Ltd 		Check for Price No Obsolete 3 V GAAS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 175 mA R-PDSO-G20 e0 Not Qualified 2 260 20 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 650 µm DUAL 4.4 mm 6.5 mm 1.45 mm NEW JAPAN RADIO CO LTD LSSOP, unknown 8542.39.00.01 SSOP 20
TG2401F
 Toshiba America Electronic Components 		Check for Price No Obsolete 3 V GAAS CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 170 mA INDUSTRIAL R-PDSO-G20 e0 Not Qualified 85 °C -40 °C 20 PLASTIC/EPOXY HTSSOP RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES Tin/Lead (Sn/Pb) GULL WING 500 µm DUAL 4.4 mm 5 mm 1.04 mm TOSHIBA CORP HTSSOP, unknown 8542.39.00.01 SOIC 20
MC145165D
 Freescale Semiconductor 		Check for Price No Obsolete CMOS 2/3.3 V OTHER R-PDSO-G16 e0 Not Qualified 70 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.25 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL MOTOROLA SEMICONDUCTOR PRODUCTS SOP, SOP16,.25 unknown
SC14408B80VD
 National Semiconductor Corporation 		Check for Price No Obsolete CMOS CORDLESS TELEPHONE BASEBAND CIRCUIT 1 S-PQFP-G80 e0 Not Qualified 80 PLASTIC/EPOXY QFP QFP80,.68SQ SQUARE FLATPACK YES TIN LEAD GULL WING 650 µm QUAD 14 mm 14 mm 2.35 mm NATIONAL SEMICONDUCTOR CORP QFP, QFP80,.68SQ unknown 8542.39.00.01
KS8803B
 Samsung Semiconductor 		Check for Price No Obsolete 5 V CMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 7 µA COMMERCIAL EXTENDED R-PDIP-T16 e0 Not Qualified 75 °C -30 °C 16 PLASTIC/EPOXY DIP DIP16,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 7.62 mm 19.4 mm 5.08 mm SAMSUNG SEMICONDUCTOR INC DIP, DIP16,.3 compliant 8542.39.00.01 DIP 16
PCD5043H
 NXP Semiconductors 		Check for Price No Obsolete 3 V CMOS CORDLESS TELEPHONE BURST MODE CONTROLLER 1 12 mA OTHER R-PQFP-G64 Not Qualified 70 °C -25 °C 64 PLASTIC/EPOXY QFP QFP64,.7X.95,40 RECTANGULAR FLATPACK YES GULL WING 1 mm QUAD 14 mm 20 mm 3.2 mm NXP SEMICONDUCTORS QFP, QFP64,.7X.95,40 unknown 8542.39.00.01
KS8800D
 Samsung Semiconductor 		Check for Price No Obsolete 4.5 V CMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 15 mA OTHER R-PDSO-G18 e0 Not Qualified 70 °C -25 °C 18 PLASTIC/EPOXY SOP SOP18,.3 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL SAMSUNG SEMICONDUCTOR INC SOP, SOP18,.3 unknown 8542.39.00.01
SC14422DVJG
 Texas Instruments 		Check for Price Obsolete 3 V CMOS CORDLESS TELEPHONE BASEBAND CIRCUIT 1 S-PQFP-G100 Not Qualified 100 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 14 mm 14 mm 1.6 mm NATIONAL SEMICONDUCTOR CORP LFQFP, unknown 8542.39.00.01
SC14402DVJG
 Texas Instruments 		Check for Price No Obsolete 3 V CMOS CORDLESS TELEPHONE BASEBAND CIRCUIT 1 S-PQFP-G100 e0 Not Qualified 100 PLASTIC/EPOXY LFQFP QFP100,.63SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES TIN LEAD GULL WING 500 µm QUAD 14 mm 14 mm 1.6 mm NATIONAL SEMICONDUCTOR CORP LFQFP, QFP100,.63SQ,20 unknown 8542.39.00.01
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