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Parametric results for: Cordless Telephone ICs

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UAA2067G-T
 NXP Semiconductors 		Check for Price Obsolete 3.6 V BICMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 OTHER S-PQFP-G32 Not Qualified 85 °C -30 °C 32 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 5 mm 5 mm 1.6 mm NXP SEMICONDUCTORS LFQFP, unknown 8542.39.00.01
UBA1706TS
 NXP Semiconductors 		Check for Price Obsolete 3.3 V BICMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 3.2 µA COMMERCIAL EXTENDED R-PDSO-G24 e4 Not Qualified 75 °C -25 °C 24 PLASTIC/EPOXY SSOP SSOP24,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES NICKEL PALLADIUM GOLD GULL WING 650 µm DUAL 5.3 mm 8.2 mm 2 mm NXP SEMICONDUCTORS SSOP, SSOP24,.3 compliant 8542.39.00.01 SSOP 24
TB31262F
 Toshiba America Electronic Components 		Check for Price No No Active 3.6 V BICMOS CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 84 mA COMMERCIAL S-PQFP-G52 Not Qualified 70 °C -20 °C NOT SPECIFIED NOT SPECIFIED 52 PLASTIC/EPOXY QFP SQUARE FLATPACK YES GULL WING 650 µm QUAD 10 mm 10 mm 2.45 mm TOSHIBA CORP QFP, unknown 8542.39.00.01 QFP 52
TB31261AF
 Toshiba America Electronic Components 		Check for Price No No Active 3.6 V BICMOS CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 33.3 µA COMMERCIAL S-PQFP-G52 Not Qualified 70 °C -20 °C NOT SPECIFIED NOT SPECIFIED 52 PLASTIC/EPOXY QFP QFP52,.52SQ SQUARE FLATPACK YES GULL WING 650 µm QUAD 10 mm 10 mm 2.45 mm TOSHIBA CORP QFP, QFP52,.52SQ unknown 8542.39.00.01 QFP 52
LMX2411MX
 National Semiconductor Corporation 		Check for Price No Obsolete 3 V BICMOS CORDLESS TELEPHONE BASEBAND CIRCUIT 1 7 mA COMMERCIAL R-PDSO-G16 e0 Not Qualified 70 °C -10 °C 16 PLASTIC/EPOXY SOP SOP16,.25 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL 3.9 mm 9.9 mm 1.75 mm NATIONAL SEMICONDUCTOR CORP SOP, SOP16,.25 compliant 8542.39.00.01
UAA3515AHL
 Philips Semiconductors 		Check for Price No Transferred 3.3 V BICMOS COMMERCIAL EXTENDED S-PQFP-G64 e0 Not Qualified 80 °C -20 °C 64 PLASTIC/EPOXY QFP QFP64,.47SQ,20 SQUARE FLATPACK YES Tin/Lead (Sn/Pb) GULL WING 500 µm QUAD PHILIPS SEMICONDUCTORS QFP, QFP64,.47SQ,20 unknown 8542.39.00.01
UBA1707TS-T
 NXP Semiconductors 		Check for Price Obsolete BICMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 COMMERCIAL EXTENDED R-PDSO-G28 Not Qualified 75 °C -25 °C 28 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE YES GULL WING 650 µm DUAL 5.3 mm 10.2 mm 2 mm NXP SEMICONDUCTORS SSOP, unknown 8542.39.00.01 SSOP 28
LMX3161CQX
 Texas Instruments 		Check for Price Obsolete 3.6 V BICMOS CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 COMMERCIAL S-PQFP-G48 Not Qualified 70 °C -10 °C 48 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 7 mm 7 mm 1.6 mm NATIONAL SEMICONDUCTOR CORP LFQFP, unknown 8542.39.00.01
ML2730DM-SR
 RF Micro Devices Inc 		Check for Price Yes Yes Obsolete 3.3 V BICMOS CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 COMMERCIAL EXTENDED S-XQCC-N40 Not Qualified 80 °C -10 °C NOT SPECIFIED NOT SPECIFIED 40 UNSPECIFIED HVQCCN LCC40,.24SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 500 µm QUAD 6 mm 6 mm 1 mm RF MICRO DEVICES INC HVQCCN, LCC40,.24SQ,20 compliant 8542.39.00.01 QFN 40
UAA2062TS
 NXP Semiconductors 		Check for Price No Obsolete 3.6 V BICMOS CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 36 µA COMMERCIAL R-PDSO-G48 Not Qualified 70 °C -10 °C 48 PLASTIC/EPOXY SSOP SSOP48,.4 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 635 µm DUAL 7.5 mm 15.875 mm 2.8 mm NXP SEMICONDUCTORS SSOP, SSOP48,.4 unknown 8542.39.00.01 SSOP 48
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