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Microcontrollers and Processors / Microprocessors / PC755BMZFU300LD
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PC755BMZFU300LD by:

RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360

Part Details for PC755BMZFU300LD by Atmel Corporation

Overview of PC755BMZFU300LD by Atmel Corporation

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Applications Education and Research Industrial Automation Telecommunications Electronic Manufacturing

Part Details for PC755BMZFU300LD

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PC755BMZFU300LD Part Data Attributes

Parametric Data
PC755BMZFU300LD Atmel Corporation
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PC755BMZFU300LD Atmel Corporation RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer ATMEL CORP
Part Package Code BGA
Package Description BGA, BGA360,19X19,50
Pin Count 360
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 100 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B360
JESD-609 Code e0
Length 25 mm
Low Power Mode YES
Number of Terminals 360
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA360,19X19,50
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.77 mm
Speed 300 MHz
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.9 V
Supply Voltage-Nom 2 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for PC755BMZFU300LD

This table gives cross-reference parts and alternative options found for PC755BMZFU300LD. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC755BMZFU300LD, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
PC755VZFU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360 Teledyne e2v PC755BMZFU300LD vs PC755VZFU300LE
PC755BVZFU300LD RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 Teledyne e2v PC755BMZFU300LD vs PC755BVZFU300LD
MPC755BVT300LE 32-BIT, 300MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-360 Freescale Semiconductor PC755BMZFU300LD vs MPC755BVT300LE
MPC755BRX300LX RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Semiconductor Products PC755BMZFU300LD vs MPC755BRX300LX
PC755BMZFU300LD RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360 Thales Group PC755BMZFU300LD vs PC755BMZFU300LD
PC755CMGHU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 Atmel Corporation PC755BMZFU300LD vs PC755CMGHU300LE
IBM25PPC750L-EB0C300W RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM PC755BMZFU300LD vs IBM25PPC750L-EB0C300W
MPC755BPX300 32-BIT, 300MHz, RISC PROCESSOR, PBGA360 NXP Semiconductors PC755BMZFU300LD vs MPC755BPX300
XPC755BPX300LD IC,MICROPROCESSOR,64-BIT,CMOS,BGA,255PIN,PLASTIC Freescale Semiconductor PC755BMZFU300LD vs XPC755BPX300LD
PC755VGU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, CERAMIC, BGA-360 Teledyne e2v PC755BMZFU300LD vs PC755VGU300LE
Part Number Description Manufacturer Compare
FWPXA270C0E416 Microprocessor, 416MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-360 Marvell Technology Group Ltd PC755BMZFU300LD vs FWPXA270C0E416
PC755MZF366LE RISC Microprocessor, 32-Bit, 366MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360 Atmel Corporation PC755BMZFU300LD vs PC755MZF366LE
TSXPC750AMGSU/T10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PC755BMZFU300LD vs TSXPC750AMGSU/T10LH
PC7448FGH1267ND RISC Microprocessor, 32-Bit, 1267MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 Teledyne e2v PC755BMZFU300LD vs PC7448FGH1267ND
MPC755BPX350TD 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360 Motorola Mobility LLC PC755BMZFU300LD vs MPC755BPX350TD
PC7447MGHU1300NC RISC Microprocessor, 32-Bit, 1300MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 Atmel Corporation PC755BMZFU300LD vs PC7447MGHU1300NC
TSPC750AVG10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group PC755BMZFU300LD vs TSPC750AVG10LE
PC7447AVGH1000NC RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v PC755BMZFU300LD vs PC7447AVGH1000NC
MPC8541VTALFX 32-BIT, 1420MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 1.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360 Freescale Semiconductor PC755BMZFU300LD vs MPC8541VTALFX
PPC7448VU1000LD 32-BIT, 1000MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360 Freescale Semiconductor PC755BMZFU300LD vs PPC7448VU1000LD

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