There are no models available for this part yet.
Overview of TSPC750AVG10LE by Thales Group
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for TSPC750AVG10LE by Thales Group
Part Data Attributes for TSPC750AVG10LE by Thales Group
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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THOMSON-CSF SEMICONDUCTORS
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Part Package Code
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BGA
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Package Description
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,
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Pin Count
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360
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Reach Compliance Code
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unknown
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ECCN Code
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3A991.A.2
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HTS Code
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8542.31.00.01
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Address Bus Width
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32
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Bit Size
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32
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Boundary Scan
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YES
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Clock Frequency-Max
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83.3 MHz
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External Data Bus Width
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64
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Format
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FLOATING POINT
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Integrated Cache
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YES
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JESD-30 Code
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S-CBGA-B360
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Low Power Mode
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YES
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Number of Terminals
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360
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Operating Temperature-Max
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110 °C
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Operating Temperature-Min
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-40 °C
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Package Body Material
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CERAMIC, METAL-SEALED COFIRED
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY
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Qualification Status
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Not Qualified
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Speed
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233 MHz
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Supply Voltage-Max
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2.7 V
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Supply Voltage-Min
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2.5 V
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Supply Voltage-Nom
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2.6 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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INDUSTRIAL
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Terminal Form
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BALL
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Terminal Position
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BOTTOM
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uPs/uCs/Peripheral ICs Type
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MICROPROCESSOR, RISC
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Alternate Parts for TSPC750AVG10LE
This table gives cross-reference parts and alternative options found for TSPC750AVG10LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC750AVG10LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TSXPC750AMGB/T10LH | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | TSPC750AVG10LE vs TSXPC750AMGB/T10LH |
| TSXPC750AMGB/Q10LH | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | TSPC750AVG10LE vs TSXPC750AMGB/Q10LH |
| TSPC750AMGU/T10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | TSPC750AVG10LE vs TSPC750AMGU/T10LE |
| TSPC750AMGB/T10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Teledyne e2v | TSPC750AVG10LE vs TSPC750AMGB/T10LE |
| TSXPC750AVG10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Teledyne e2v | TSPC750AVG10LE vs TSXPC750AVG10LE |
| TSPC750AVGU/T10LH | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | TSPC750AVG10LE vs TSPC750AVGU/T10LH |
| TSPC750AVGU10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | TSPC750AVG10LE vs TSPC750AVGU10LE |
| TSPC750AMGB/Q10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | TSPC750AVG10LE vs TSPC750AMGB/Q10LE |
| TSXPC750AMGB/T10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | TSPC750AVG10LE vs TSXPC750AMGB/T10LE |
| TSXPC750AMGB/Q10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Teledyne e2v | TSPC750AVG10LE vs TSXPC750AMGB/Q10LE |