There are no models available for this part yet.
Overview of MPC755BRX300LX by Motorola Semiconductor Products
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
Healthcare
Renewable Energy
Robotics and Drones
CAD Models for MPC755BRX300LX by Motorola Semiconductor Products
Part Data Attributes for MPC755BRX300LX by Motorola Semiconductor Products
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|---|---|
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Part Life Cycle Code
|
Obsolete
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Ihs Manufacturer
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MOTOROLA INC
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Package Description
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BGA,
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Reach Compliance Code
|
unknown
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ECCN Code
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3A991.A.2
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HTS Code
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8542.31.00.01
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Address Bus Width
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32
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Bit Size
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32
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Boundary Scan
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YES
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Clock Frequency-Max
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100 MHz
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External Data Bus Width
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64
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Format
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FLOATING POINT
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Integrated Cache
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YES
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JESD-30 Code
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S-CBGA-B360
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Length
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25 mm
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Low Power Mode
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YES
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Number of Terminals
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360
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Package Body Material
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CERAMIC, METAL-SEALED COFIRED
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Package Code
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BGA
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY
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Qualification Status
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Not Qualified
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Seated Height-Max
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3.2 mm
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Speed
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300 MHz
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Supply Voltage-Max
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2.1 V
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Supply Voltage-Min
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1.8 V
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Supply Voltage-Nom
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2 V
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Surface Mount
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YES
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Technology
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CMOS
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Terminal Form
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BALL
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Terminal Pitch
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1.27 mm
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Terminal Position
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BOTTOM
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Width
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25 mm
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uPs/uCs/Peripheral ICs Type
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MICROPROCESSOR, RISC
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Alternate Parts for MPC755BRX300LX
This table gives cross-reference parts and alternative options found for MPC755BRX300LX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC755BRX300LX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MPC755BPX300 | 32-BIT, 300MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-360 | Freescale Semiconductor | MPC755BRX300LX vs MPC755BPX300 |
| PC755VGHU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Teledyne e2v | MPC755BRX300LX vs PC755VGHU300LE |
| MPC755BRX300LX | 32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Motorola Mobility LLC | MPC755BRX300LX vs MPC755BRX300LX |
| PC755CMGU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Atmel Corporation | MPC755BRX300LX vs PC755CMGU300LE |
| PC755VGH300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Teledyne e2v | MPC755BRX300LX vs PC755VGH300LE |
| MPC755BRX300LE | 32-BIT, 300MHz, RISC PROCESSOR, CBGA360 | NXP Semiconductors | MPC755BRX300LX vs MPC755BRX300LE |
| XPC755BPX300LD | 32-BIT, 300MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 | Motorola Mobility LLC | MPC755BRX300LX vs XPC755BPX300LD |
| IBM25PPC750L-EB0B300W | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | IBM | MPC755BRX300LX vs IBM25PPC750L-EB0B300W |
| MPC755BPX300LE | 32-BIT, 300MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, PLASTIC, BGA-360 | Motorola Mobility LLC | MPC755BRX300LX vs MPC755BPX300LE |
| XPC755BRX300LE | 32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, CERAMIC, BGA-360 | Motorola Mobility LLC | MPC755BRX300LX vs XPC755BRX300LE |