Part Details for NTE2532 by NTE Electronics Inc
Overview of NTE2532 by NTE Electronics Inc
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Electronic Manufacturing
Entertainment and Gaming
Price & Stock for NTE2532
| Part # | Distributor | Description | Stock | Price | Buy | |
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Onlinecomponents.com | EPROM - NMOS Memory - 32K - 300ns - UV Erasable - 24-lead DIP |
2 In Stock |
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$22.0500 / $32.6100 | Buy Now |
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Bristol Electronics | 1 |
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RFQ | ||
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Quest Components | UVPROM, 4KX8, 300NS, NMOS | 2 |
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$21.4403 | Buy Now |
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Quest Components | UVPROM, 4KX8, 300NS, NMOS | 1 |
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$20.8000 | Buy Now |
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Master Electronics | EPROM - NMOS Memory - 32K - 300ns - UV Erasable - 24-lead DIP |
2 In Stock |
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$22.0500 / $32.6100 | Buy Now |
Part Details for NTE2532
NTE2532 CAD Models
NTE2532 Part Data Attributes:
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NTE2532
NTE Electronics Inc
Buy Now
Datasheet
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Compare Parts:
NTE2532
NTE Electronics Inc
UVPROM, 4KX8, 300ns, NMOS, DIP-24
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NTE ELECTRONICS INC | |
| Part Package Code | DIP | |
| Package Description | DIP-24 | |
| Pin Count | 24 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 300 ns | |
| JESD-30 Code | R-XDIP-T24 | |
| Memory Density | 32768 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 4096 words | |
| Number of Words Code | 4000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 4KX8 | |
| Package Body Material | UNSPECIFIED | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Supply Current-Max | 0.16 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | NMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |
Alternate Parts for NTE2532
This table gives cross-reference parts and alternative options found for NTE2532. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NTE2532, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| QD2732A-3 | UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | Intel Corporation | NTE2532 vs QD2732A-3 |
| AM2732B-300DE | UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | NTE2532 vs AM2732B-300DE |
| QD2732A-30 | UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | Intel Corporation | NTE2532 vs QD2732A-30 |
| AM2732B-300DC | UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | NTE2532 vs AM2732B-300DC |
| AM2732B-305DI | UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | NTE2532 vs AM2732B-305DI |
| 8001210JX | UVPROM, 4KX8, 300ns, NMOS, 1.290 X 0.610 INCH, 0.225 INCH HEIGHT, DIP-24 | AMD | NTE2532 vs 8001210JX |
| AM2732B-305DC | UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | NTE2532 vs AM2732B-305DC |
| M2732A-30F1 | 4KX8 UVPROM, 300ns, CDIP24, FRIT SEALED, CERAMIC, DIP-24 | STMicroelectronics | NTE2532 vs M2732A-30F1 |
| M2732A-3F6 | 4KX8 UVPROM, 300ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 | STMicroelectronics | NTE2532 vs M2732A-3F6 |
| AM2732B-300/BJA | UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | NTE2532 vs AM2732B-300/BJA |