Datasheets
QD2732A-3 by: Intel Corporation

UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24

Part Details for QD2732A-3 by Intel Corporation

Overview of QD2732A-3 by Intel Corporation

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Part Details for QD2732A-3

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QD2732A-3 Part Data Attributes

QD2732A-3 Intel Corporation
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QD2732A-3 Intel Corporation UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEL CORP
Part Package Code DIP
Package Description WDIP, DIP24,.6
Pin Count 24
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 300 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T24
JESD-609 Code e0
Length 32.004 mm
Memory Density 32768 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 4096 words
Number of Words Code 4000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 4KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Programming Voltage 21 V
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology NMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for QD2732A-3

This table gives cross-reference parts and alternative options found for QD2732A-3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of QD2732A-3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM2732B-300DC UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD QD2732A-3 vs AM2732B-300DC
AM2732B-300DI UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD QD2732A-3 vs AM2732B-300DI
NTE2532 UVPROM, 4KX8, 300ns, NMOS, DIP-24 NTE Electronics Inc QD2732A-3 vs NTE2532
AM2732B-300/BJA UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD QD2732A-3 vs AM2732B-300/BJA
M2732A-3F6 4KX8 UVPROM, 300ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 STMicroelectronics QD2732A-3 vs M2732A-3F6
AM2732B-305DI UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD QD2732A-3 vs AM2732B-305DI
M2732A-3F1 4KX8 UVPROM, 300ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 STMicroelectronics QD2732A-3 vs M2732A-3F1
AM2732B-305DC UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD QD2732A-3 vs AM2732B-305DC
Part Number Description Manufacturer Compare
AM2732B-300LC UVPROM, 4KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 AMD QD2732A-3 vs AM2732B-300LC
NMC27C32-30 4KX8 UVPROM, 300ns, CDIP24, WINDOWED, CERAMIC, DIP-24 Texas Instruments QD2732A-3 vs NMC27C32-30
AM2732B-300LI UVPROM, 4KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 AMD QD2732A-3 vs AM2732B-300LI
M2732A-3F1 4KX8 UVPROM, 300ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 STMicroelectronics QD2732A-3 vs M2732A-3F1
AM2732B-300DC UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD QD2732A-3 vs AM2732B-300DC
NMC27C32H-35 4KX8 UVPROM, 350ns, CDIP24, WINDOWED, CERAMIC, DIP-24 Texas Instruments QD2732A-3 vs NMC27C32H-35
M2732A-3F6 4KX8 UVPROM, 300ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 STMicroelectronics QD2732A-3 vs M2732A-3F6
NMC27C32-35 IC 4K X 8 UVPROM, 350 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM National Semiconductor Corporation QD2732A-3 vs NMC27C32-35
NMC27C32H-30 IC 4K X 8 UVPROM, 300 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM Texas Instruments QD2732A-3 vs NMC27C32H-30
AM2732B-305DC UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD QD2732A-3 vs AM2732B-305DC

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