Part Details for TMS2532-30JL by Texas Instruments
Overview of TMS2532-30JL by Texas Instruments
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Price & Stock for TMS2532-30JL
| Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | UVPROM, 4KX8, 450NS, MOS, CDIP24 | 17 |
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$16.2500 | Buy Now |
Part Details for TMS2532-30JL
TMS2532-30JL CAD Models
TMS2532-30JL Part Data Attributes:
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TMS2532-30JL
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
TMS2532-30JL
Texas Instruments
IC 4K X 8 UVPROM, 300 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP24,.6 | |
| Pin Count | 24 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 300 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-CDIP-T24 | |
| Memory Density | 32768 bit | |
| Memory IC Type | UVPROM CARD | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 4096 words | |
| Number of Words Code | 4000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 4KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP24,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Supply Current-Max | 0.095 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Alternate Parts for TMS2532-30JL
This table gives cross-reference parts and alternative options found for TMS2532-30JL. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TMS2532-30JL, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM2732B-300DC | UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | TMS2532-30JL vs AM2732B-300DC |
| AM2732B-300LE | UVPROM, 4KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 | AMD | TMS2532-30JL vs AM2732B-300LE |
| AM2732B-305DC | UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | TMS2532-30JL vs AM2732B-305DC |
| NMC27C32H-35 | IC 4K X 8 UVPROM, 350 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM | National Semiconductor Corporation | TMS2532-30JL vs NMC27C32H-35 |
| AM2732B-305LI | UVPROM, 4KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 | AMD | TMS2532-30JL vs AM2732B-305LI |
| AM2732B-305DI | UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | TMS2532-30JL vs AM2732B-305DI |
| NMC27C32-35 | IC 4K X 8 UVPROM, 350 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM | National Semiconductor Corporation | TMS2532-30JL vs NMC27C32-35 |
| NMC27C32H-30 | IC 4K X 8 UVPROM, 300 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM | Texas Instruments | TMS2532-30JL vs NMC27C32H-30 |
| QD2732A-3 | UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | Intel Corporation | TMS2532-30JL vs QD2732A-3 |
| M2732A-3F1 | 4KX8 UVPROM, 300ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 | STMicroelectronics | TMS2532-30JL vs M2732A-3F1 |