Part Details for AM2732B-305DC by AMD
Overview of AM2732B-305DC by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (7 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Part Details for AM2732B-305DC
AM2732B-305DC CAD Models
AM2732B-305DC Part Data Attributes
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AM2732B-305DC
AMD
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Datasheet
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AM2732B-305DC
AMD
UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | WDIP, DIP24,.6 | |
| Pin Count | 24 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 300 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T24 | |
| JESD-609 Code | e0 | |
| Length | 32.0675 mm | |
| Memory Density | 32768 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 4096 words | |
| Number of Words Code | 4000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 4KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP24,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.588 mm | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | NMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for AM2732B-305DC
This table gives cross-reference parts and alternative options found for AM2732B-305DC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM2732B-305DC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM2732B-300DC | UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | AM2732B-305DC vs AM2732B-300DC |
| AM2732B-300DI | UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | AM2732B-305DC vs AM2732B-300DI |
| NTE2532 | UVPROM, 4KX8, 300ns, NMOS, DIP-24 | NTE Electronics Inc | AM2732B-305DC vs NTE2532 |
| AM2732B-300/BJA | UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | AM2732B-305DC vs AM2732B-300/BJA |
| M2732A-3F6 | 4KX8 UVPROM, 300ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 | STMicroelectronics | AM2732B-305DC vs M2732A-3F6 |
| AM2732B-305DI | UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | AM2732B-305DC vs AM2732B-305DI |
| M2732A-3F1 | 4KX8 UVPROM, 300ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 | STMicroelectronics | AM2732B-305DC vs M2732A-3F1 |