Datasheets
NMC27C32-30 by:

4KX8 UVPROM, 300ns, CDIP24, WINDOWED, CERAMIC, DIP-24

Part Details for NMC27C32-30 by Texas Instruments

Overview of NMC27C32-30 by Texas Instruments

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Applications Consumer Electronics Industrial Automation

Part Details for NMC27C32-30

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NMC27C32-30 Part Data Attributes

NMC27C32-30 Texas Instruments
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NMC27C32-30 Texas Instruments 4KX8 UVPROM, 300ns, CDIP24, WINDOWED, CERAMIC, DIP-24
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description WDIP, DIP24,.6
Pin Count 24
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 300 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T24
JESD-609 Code e0
Memory Density 32768 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 4096 words
Number of Words Code 4000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 4KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.715 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.01 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for NMC27C32-30

This table gives cross-reference parts and alternative options found for NMC27C32-30. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NMC27C32-30, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
NMC27C32H-30 IC 4K X 8 UVPROM, 300 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM Texas Instruments NMC27C32-30 vs NMC27C32H-30
NMC27C32H-30 IC 4K X 8 UVPROM, 300 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM National Semiconductor Corporation NMC27C32-30 vs NMC27C32H-30
Part Number Description Manufacturer Compare
AM2732B-300LC UVPROM, 4KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 AMD NMC27C32-30 vs AM2732B-300LC
AM2732B-300LI UVPROM, 4KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 AMD NMC27C32-30 vs AM2732B-300LI
M2732A-3F1 4KX8 UVPROM, 300ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 STMicroelectronics NMC27C32-30 vs M2732A-3F1
AM2732B-300DC UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD NMC27C32-30 vs AM2732B-300DC
NMC27C32H-35 4KX8 UVPROM, 350ns, CDIP24, WINDOWED, CERAMIC, DIP-24 Texas Instruments NMC27C32-30 vs NMC27C32H-35
M2732A-3F6 4KX8 UVPROM, 300ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 STMicroelectronics NMC27C32-30 vs M2732A-3F6
NMC27C32-35 IC 4K X 8 UVPROM, 350 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM National Semiconductor Corporation NMC27C32-30 vs NMC27C32-35
NMC27C32H-30 IC 4K X 8 UVPROM, 300 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM Texas Instruments NMC27C32-30 vs NMC27C32H-30
AM2732B-305DC UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD NMC27C32-30 vs AM2732B-305DC
AM2732B-305DI UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD NMC27C32-30 vs AM2732B-305DI

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