Part Details for MT18HTF12872FDZ-667G1D6 by Micron Technology Inc
Overview of MT18HTF12872FDZ-667G1D6 by Micron Technology Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (1 cross)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Price & Stock for MT18HTF12872FDZ-667G1D6
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
MT18HTF12872FDZ-66
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Avnet Americas | DRAM Module DDR2 SDRAM 1Gbyte 240FBDIMM - Trays (Alt: MT18HTF12872FDZ-66) RoHS: Compliant Min Qty: 100 Package Multiple: 100 Container: Tray | 0 |
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RFQ | |
DISTI #
MT18HTF12872FDZ-66
|
Avnet Americas | DRAM Module DDR2 SDRAM 1Gbyte 240FBDIMM - Trays (Alt: MT18HTF12872FDZ-66) RoHS: Compliant Min Qty: 100 Package Multiple: 100 Container: Tray | 0 |
|
RFQ |
Part Details for MT18HTF12872FDZ-667G1D6
MT18HTF12872FDZ-667G1D6 CAD Models
MT18HTF12872FDZ-667G1D6 Part Data Attributes:
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MT18HTF12872FDZ-667G1D6
Micron Technology Inc
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Datasheet
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Compare Parts:
MT18HTF12872FDZ-667G1D6
Micron Technology Inc
DRAM, 128MX72, CMOS, PDMA240
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Package Description | DIMM, DIMM240,40 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Clock Frequency-Max (fCLK) | 333 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-PDMA-N240 | |
JESD-609 Code | e3 | |
Memory Density | 9663676416 bit | |
Memory Width | 72 | |
Moisture Sensitivity Level | 1 | |
Number of Terminals | 240 | |
Number of Words | 134217728 words | |
Number of Words Code | 128000000 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 128MX72 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIMM | |
Package Equivalence Code | DIMM240,40 | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Qualification Status | Not Qualified | |
Refresh Cycles | 8192 | |
Supply Current-Max | 4.48 mA | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | NO LEAD | |
Terminal Pitch | 1 mm | |
Terminal Position | DUAL |
Alternate Parts for MT18HTF12872FDZ-667G1D6
This table gives cross-reference parts and alternative options found for MT18HTF12872FDZ-667G1D6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MT18HTF12872FDZ-667G1D6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
MT18HTF12872FDZ-667XXXX | DDR DRAM Module, 128MX72, CMOS, FBDIMM-240 | Micron Technology Inc | MT18HTF12872FDZ-667G1D6 vs MT18HTF12872FDZ-667XXXX |