MT18HTF12872FDZ-667G1D6
vs
MT18HTF12872FDZ-667XXXX
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
MICRON TECHNOLOGY INC
|
| Package Description |
DIMM, DIMM240,40
|
FBDIMM-240
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.36
|
8542.32.00.36
|
| Clock Frequency-Max (fCLK) |
333 MHz
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PDMA-N240
|
R-XDMA-N240
|
| JESD-609 Code |
e3
|
e3
|
| Memory Density |
9663676416 bit
|
9663676416 bit
|
| Memory Width |
72
|
72
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Terminals |
240
|
240
|
| Number of Words |
134217728 words
|
134217728 words
|
| Number of Words Code |
128000000
|
128000000
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
128MX72
|
128MX72
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
DIMM
|
DIMM
|
| Package Equivalence Code |
DIMM240,40
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Qualification Status |
Not Qualified
|
|
| Refresh Cycles |
8192
|
|
| Supply Current-Max |
4.48 mA
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Access Mode |
|
DUAL BANK PAGE BURST
|
| Additional Feature |
|
REFRESH; WD-MAX
|
| Length |
|
133.35 mm
|
| Memory IC Type |
|
DDR DRAM MODULE
|
| Number of Functions |
|
1
|
| Number of Ports |
|
1
|
| Operating Mode |
|
SYNCHRONOUS
|
| Seated Height-Max |
|
30.5 mm
|
| Supply Voltage-Nom (Vsup) |
|
1.8 V
|
| Width |
|
5.1 mm
|
|
|
|
Compare MT18HTF12872FDZ-667G1D6 with alternatives
Compare MT18HTF12872FDZ-667XXXX with alternatives