Datasheets
HY23V08250D-100 by:

MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42

Part Details for HY23V08250D-100 by SK Hynix Inc

Overview of HY23V08250D-100 by SK Hynix Inc

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Part Details for HY23V08250D-100

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HY23V08250D-100 Part Data Attributes

HY23V08250D-100 SK Hynix Inc
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HY23V08250D-100 SK Hynix Inc MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42
Part Life Cycle Code Obsolete
Ihs Manufacturer SK HYNIX INC
Part Package Code DIP
Package Description DIP, DIP42,.6
Pin Count 42
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 100 ns
Alternate Memory Width 8
JESD-30 Code R-PDIP-T42
Length 52.451 mm
Memory Density 8388608 bit
Memory IC Type MASK ROM
Memory Width 16
Number of Functions 1
Number of Terminals 42
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 512KX16
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP42,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 4.826 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for HY23V08250D-100

This table gives cross-reference parts and alternative options found for HY23V08250D-100. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HY23V08250D-100, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
K3P4V1000D-DC10 MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 Samsung Semiconductor HY23V08250D-100 vs K3P4V1000D-DC10
MR27V852E-XXXRA MASK ROM, 512KX16, 100ns, CMOS, PDIP42, PLASTIC, DIP-42 LAPIS Semiconductor Co Ltd HY23V08250D-100 vs MR27V852E-XXXRA
K3P4V1000E-DC10 MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 Samsung Semiconductor HY23V08250D-100 vs K3P4V1000E-DC10
MX23L8111PC-10 MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 Macronix International Co Ltd HY23V08250D-100 vs MX23L8111PC-10
HY23V08200D-100 MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 SK Hynix Inc HY23V08250D-100 vs HY23V08200D-100
MR27V852E-XXXRA MASK ROM, 512KX16, 100ns, CMOS, PDIP42, PLASTIC, DIP-42 OKI Electric Industry Co Ltd HY23V08250D-100 vs MR27V852E-XXXRA
MR53V8052J-XXRA MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 LAPIS Semiconductor Co Ltd HY23V08250D-100 vs MR53V8052J-XXRA
KM23V8105D-10 MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 Samsung Semiconductor HY23V08250D-100 vs KM23V8105D-10
K3N4V1000D-DC100 MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 Samsung Semiconductor HY23V08250D-100 vs K3N4V1000D-DC100
MR27V802D-XXRA MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 OKI Electric Industry Co Ltd HY23V08250D-100 vs MR27V802D-XXRA
Part Number Description Manufacturer Compare
K3N4C1000E-DC120 MASK ROM, 512KX16, 120ns, CMOS, PDIP42, 0.600 INCH, DIP-42 Samsung Semiconductor HY23V08250D-100 vs K3N4C1000E-DC120
K3P4C1000E-DC100 MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 Samsung Semiconductor HY23V08250D-100 vs K3P4C1000E-DC100
MSM27C802ZB-NRS OTP ROM, 1MX8, 120ns, CMOS, PDIP42, PLASTIC, DIP-42 OKI Electric Industry Co Ltd HY23V08250D-100 vs MSM27C802ZB-NRS
LH538600D-10 MASK ROM, 1MX8, 100ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 Sharp Corp HY23V08250D-100 vs LH538600D-10
MR53V8002J-XXRA MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 LAPIS Semiconductor Co Ltd HY23V08250D-100 vs MR53V8002J-XXRA
AM27C800-125DEB UVPROM, 1MX8, 120ns, CMOS, CDIP42, WINDOWED, CERAMIC, DIP-42 AMD HY23V08250D-100 vs AM27C800-125DEB
LH53B8V00D MASK ROM, 1MX8, 85ns, CMOS, PDIP42, DIP-42 Sharp Corp HY23V08250D-100 vs LH53B8V00D
AM27C800-250/BXA UVPROM, 1MX8, 250ns, CMOS, CDIP42, WINDOWED, CERAMIC, DIP-42 AMD HY23V08250D-100 vs AM27C800-250/BXA
MR53V8052J-XXRA MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 LAPIS Semiconductor Co Ltd HY23V08250D-100 vs MR53V8052J-XXRA
M27C800-150XF6 512KX16 UVPROM, 120ns, CDIP42, WINDOWED, FRIT SEALED, CERAMIC, DIP-42 STMicroelectronics HY23V08250D-100 vs M27C800-150XF6

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