HY23V08250D-100
vs
MR53V8002J-XXRA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
LAPIS SEMICONDUCTOR CO LTD
Part Package Code
DIP
DIP
Package Description
DIP, DIP42,.6
DIP, DIP42,.6
Pin Count
42
42
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
100 ns
100 ns
Alternate Memory Width
8
8
JESD-30 Code
R-PDIP-T42
R-PDIP-T42
Length
52.451 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
MASK ROM
MASK ROM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
42
42
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512KX16
512KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP42,.6
DIP42,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.826 mm
Standby Current-Max
0.00005 A
0.00001 A
Supply Current-Max
0.06 mA
0.04 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
Base Number Matches
1
1
Rohs Code
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare HY23V08250D-100 with alternatives
Compare MR53V8002J-XXRA with alternatives