Part Details for MX23L8111PC-10 by Macronix International Co Ltd
Overview of MX23L8111PC-10 by Macronix International Co Ltd
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for MX23L8111PC-10
MX23L8111PC-10 CAD Models
MX23L8111PC-10 Part Data Attributes
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MX23L8111PC-10
Macronix International Co Ltd
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Datasheet
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MX23L8111PC-10
Macronix International Co Ltd
MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MACRONIX INTERNATIONAL CO LTD | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP42,.6 | |
| Pin Count | 42 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 100 ns | |
| Additional Feature | USER CONFIGURABLE AS 1M X 8 | |
| Alternate Memory Width | 8 | |
| JESD-30 Code | R-PDIP-T42 | |
| JESD-609 Code | e0 | |
| Length | 51.94 mm | |
| Memory Density | 8388608 bit | |
| Memory IC Type | MASK ROM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 42 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512KX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP42,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.9 mm | |
| Standby Current-Max | 0.00002 A | |
| Supply Current-Max | 0.02 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for MX23L8111PC-10
This table gives cross-reference parts and alternative options found for MX23L8111PC-10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MX23L8111PC-10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| K3N4V1000D-DC10 | MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | Samsung Semiconductor | MX23L8111PC-10 vs K3N4V1000D-DC10 |
| MR27V802D-XXRA | MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 | LAPIS Semiconductor Co Ltd | MX23L8111PC-10 vs MR27V802D-XXRA |
| HY23V08200D-100 | MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 | SK Hynix Inc | MX23L8111PC-10 vs HY23V08200D-100 |
| MR53V8002J-XXRA | MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 | LAPIS Semiconductor Co Ltd | MX23L8111PC-10 vs MR53V8002J-XXRA |
| MR53V8052J-XXRA | MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 | LAPIS Semiconductor Co Ltd | MX23L8111PC-10 vs MR53V8052J-XXRA |
| K3N4V1000D-DC100 | MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | Samsung Semiconductor | MX23L8111PC-10 vs K3N4V1000D-DC100 |
| MR53V8052J-XXRA | MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 | OKI Electric Industry Co Ltd | MX23L8111PC-10 vs MR53V8052J-XXRA |
| KM23V8100D-10 | MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | Samsung Semiconductor | MX23L8111PC-10 vs KM23V8100D-10 |
| MR27V852E-XXXRA | MASK ROM, 512KX16, 100ns, CMOS, PDIP42, PLASTIC, DIP-42 | OKI Electric Industry Co Ltd | MX23L8111PC-10 vs MR27V852E-XXXRA |
| K3N4V1000E-DC10 | MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | Samsung Semiconductor | MX23L8111PC-10 vs K3N4V1000E-DC10 |