Part Details for F10416DC by Fairchild Semiconductor Corporation
Overview of F10416DC by Fairchild Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for F10416DC
F10416DC CAD Models
F10416DC Part Data Attributes:
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F10416DC
Fairchild Semiconductor Corporation
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Datasheet
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F10416DC
Fairchild Semiconductor Corporation
OTP ROM, 256X4, 20ns, ECL10K, CDIP16,
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | FAIRCHILD SEMICONDUCTOR CORP | |
| Package Description | DIP, DIP16,.3 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 20 ns | |
| JESD-30 Code | R-XDIP-T16 | |
| JESD-609 Code | e0 | |
| Memory Density | 1024 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 4 | |
| Moisture Sensitivity Level | 2A | |
| Number of Terminals | 16 | |
| Number of Words | 256 words | |
| Number of Words Code | 256 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -30 °C | |
| Organization | 256X4 | |
| Package Body Material | CERAMIC | |
| Package Code | DIP | |
| Package Equivalence Code | DIP16,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Qualification Status | Not Qualified | |
| Surface Mount | NO | |
| Technology | ECL10K | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |
Alternate Parts for F10416DC
This table gives cross-reference parts and alternative options found for F10416DC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of F10416DC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27S20ADCB | OTP ROM, 256X4, 30ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | F10416DC vs AM27S20ADCB |
| AM27S21/BEA | OTP ROM, 256X4, 60ns, Bipolar, CDIP16, CERAMIC, DIP-16 | AMD | F10416DC vs AM27S21/BEA |
| M38510/20302BEA | OTP ROM, 256X4, 75ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 | Lansdale Semiconductor Inc | F10416DC vs M38510/20302BEA |
| IDM29761JC | 256X4 OTPROM, 50ns, CDIP16, HERMETIC SEALED, DIP-16 | Texas Instruments | F10416DC vs IDM29761JC |
| M54701AP-1 | OTP ROM, 256X4, 30ns, Bipolar, PDIP16, PLASTIC, DIP-16 | Mitsubishi Electric | F10416DC vs M54701AP-1 |
| N82S126B | 256X4 OTPROM, 50ns, PDIP16 | Philips Semiconductors | F10416DC vs N82S126B |
| DM74S287AJ | 256X4 OTPROM, 30ns, CDIP16, CERAMIC, DIP-16 | Texas Instruments | F10416DC vs DM74S287AJ |
| N82S229B | OTP ROM, 256X4, 50ns, Bipolar, PDIP16, | Signetics | F10416DC vs N82S229B |
| N82S229B | IC 256 X 4 OTPROM, 50 ns, PDIP16, Programmable ROM | NXP Semiconductors | F10416DC vs N82S229B |
| N82S226F | 256X4 OTPROM, 50ns, CDIP16 | Philips Semiconductors | F10416DC vs N82S226F |