Part Details for DM74S287AJ by Texas Instruments
Overview of DM74S287AJ by Texas Instruments
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for DM74S287AJ
DM74S287AJ CAD Models
DM74S287AJ Part Data Attributes:
|
|
DM74S287AJ
Texas Instruments
Buy Now
Datasheet
|
Compare Parts:
DM74S287AJ
Texas Instruments
256X4 OTPROM, 30ns, CDIP16, CERAMIC, DIP-16
|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP16,.3 | |
| Pin Count | 16 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 30 ns | |
| JESD-30 Code | R-GDIP-T16 | |
| JESD-609 Code | e0 | |
| Length | 19.43 mm | |
| Memory Density | 1024 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 4 | |
| Number of Functions | 1 | |
| Number of Terminals | 16 | |
| Number of Words | 256 words | |
| Number of Words Code | 256 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 256X4 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP16,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Supply Current-Max | 0.13 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for DM74S287AJ
This table gives cross-reference parts and alternative options found for DM74S287AJ. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DM74S287AJ, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27S20ADCB | OTP ROM, 256X4, 30ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | DM74S287AJ vs AM27S20ADCB |
| N82S126AN | OTP ROM, 256X4, 30ns, Bipolar, PDIP16, | Signetics | DM74S287AJ vs N82S126AN |
| AM27S21ADCB | OTP ROM, 256X4, 30ns, Bipolar, CDIP16, CERAMIC, DIP-16 | AMD | DM74S287AJ vs AM27S21ADCB |
| N82S126ANB | IC 256 X 4 OTPROM, 30 ns, PDIP16, Programmable ROM | NXP Semiconductors | DM74S287AJ vs N82S126ANB |
| N82S126AN | IC 256 X 4 OTPROM, 30 ns, PDIP16, Programmable ROM | NXP Semiconductors | DM74S287AJ vs N82S126AN |
| AM27S20APCB | OTP ROM, 256X4, 30ns, Bipolar, PDIP16, PLASTIC, DIP-16 | AMD | DM74S287AJ vs AM27S20APCB |
| N82S126ANB | 256X4 OTPROM, 30ns, PDIP16 | Philips Semiconductors | DM74S287AJ vs N82S126ANB |
| DM74S387AJ | IC 256 X 4 OTPROM, 30 ns, CDIP16, CERAMIC, DIP-16, Programmable ROM | Texas Instruments | DM74S287AJ vs DM74S387AJ |
| 63S141ANXXXX | OTP ROM, 256X4, 30ns, CMOS, PDIP16, | Monolithic Memories (RETIRED) | DM74S287AJ vs 63S141ANXXXX |
| M54700AP-1 | OTP ROM, 256X4, 30ns, Bipolar, PDIP16, PLASTIC, DIP-16 | Mitsubishi Electric | DM74S287AJ vs M54700AP-1 |