Datasheets
PC7447VGU1000NB by:

RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

Part Details for PC7447VGU1000NB by Teledyne e2v

Overview of PC7447VGU1000NB by Teledyne e2v

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Applications Space Technology Computing and Data Storage Aerospace and Defense Automotive

Part Details for PC7447VGU1000NB

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PC7447VGU1000NB Part Data Attributes

PC7447VGU1000NB Teledyne e2v
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PC7447VGU1000NB Teledyne e2v RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
Part Life Cycle Code Active
Ihs Manufacturer TELEDYNE E2V (UK) LTD
Part Package Code BGA
Package Description BGA,
Pin Count 360
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Additional Feature ALSO REQUIRES 1.8V OR 2.5V SUPPLY
Address Bus Width 36
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 167 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B360
Length 25 mm
Low Power Mode YES
Number of Terminals 360
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.2 mm
Speed 1000 MHz
Supply Voltage-Max 1.15 V
Supply Voltage-Min 1.05 V
Supply Voltage-Nom 1.1 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for PC7447VGU1000NB

This table gives cross-reference parts and alternative options found for PC7447VGU1000NB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC7447VGU1000NB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
PC7447AVGHY1000NC RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HITCE, CERAMIC, BGA-360 Teledyne e2v PC7447VGU1000NB vs PC7447AVGHY1000NC
PC7447VGU1000NC RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation PC7447VGU1000NB vs PC7447VGU1000NC
PC7447AVGH1000NC RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Atmel Corporation PC7447VGU1000NB vs PC7447AVGH1000NC
PCX7447AMGHY1000NB RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, HITCE, BGA-360 Teledyne e2v PC7447VGU1000NB vs PCX7447AMGHY1000NB
PC7447AVLH1000NB RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, LGA-360 Atmel Corporation PC7447VGU1000NB vs PC7447AVLH1000NB
PC7447AMLH1000NC RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, LGA-360 Teledyne e2v PC7447VGU1000NB vs PC7447AMLH1000NC
PC7447MGHU1000NC RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 Teledyne e2v PC7447VGU1000NB vs PC7447MGHU1000NC
PC7447AMLH1000NC RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, LGA-360 Atmel Corporation PC7447VGU1000NB vs PC7447AMLH1000NC
KMC7447RX1000NB RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-360 Motorola Semiconductor Products PC7447VGU1000NB vs KMC7447RX1000NB
PC7447MGHU1000NB RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 Teledyne e2v PC7447VGU1000NB vs PC7447MGHU1000NB
Part Number Description Manufacturer Compare
FWPXA270C0E416 Microprocessor, 416MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-360 Marvell Technology Group Ltd PC7447VGU1000NB vs FWPXA270C0E416
PC755MZF366LE RISC Microprocessor, 32-Bit, 366MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360 Atmel Corporation PC7447VGU1000NB vs PC755MZF366LE
TSXPC750AMGSU/T10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PC7447VGU1000NB vs TSXPC750AMGSU/T10LH
PC7448FGH1267ND RISC Microprocessor, 32-Bit, 1267MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 Teledyne e2v PC7447VGU1000NB vs PC7448FGH1267ND
MPC755BPX350TD 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360 Motorola Mobility LLC PC7447VGU1000NB vs MPC755BPX350TD
PC7447MGHU1300NC RISC Microprocessor, 32-Bit, 1300MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 Atmel Corporation PC7447VGU1000NB vs PC7447MGHU1300NC
TSPC750AVG10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group PC7447VGU1000NB vs TSPC750AVG10LE
PC7447AVGH1000NC RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v PC7447VGU1000NB vs PC7447AVGH1000NC
MPC8541VTALFX 32-BIT, 1420MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 1.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360 Freescale Semiconductor PC7447VGU1000NB vs MPC8541VTALFX
PPC7448VU1000LD 32-BIT, 1000MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360 Freescale Semiconductor PC7447VGU1000NB vs PPC7448VU1000LD

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