PHM30NQ10T,518 vs PH1955L,115 feature comparison

PHM30NQ10T,518 NXP Semiconductors

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PH1955L,115 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOT SOIC
Package Description SMALL OUTLINE, R-PDSO-N8 PLASTIC, LFPAK-4
Pin Count 8 4
Manufacturer Package Code SOT685-1 SOT669
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 100 V 55 V
Drain Current-Max (ID) 37.6 A 40 A
Drain-source On Resistance-Max 0.02 Ω 0.021 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JESD-30 Code R-PDSO-N8 R-PSSO-G4
Number of Elements 1 1
Number of Terminals 8 4
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Operating Temperature-Max 150 °C 175 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type N-CHANNEL N-CHANNEL
Pulsed Drain Current-Max (IDM) 60 A 160 A
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form NO LEAD GULL WING
Terminal Position DUAL SINGLE
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 1 2
Rohs Code Yes
Avalanche Energy Rating (Eas) 80 mJ
Case Connection DRAIN
JEDEC-95 Code MO-235
JESD-609 Code e3
Moisture Sensitivity Level 1
Power Dissipation-Max (Abs) 75 W
Terminal Finish TIN

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