PH1955L,115 vs PH20100S,115 feature comparison

PH1955L,115 NXP Semiconductors

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PH20100S,115 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description PLASTIC, LFPAK-4 PLASTIC, LFPAK-4
Pin Count 4 4
Manufacturer Package Code SOT669 SOT669
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
Avalanche Energy Rating (Eas) 80 mJ 250 mJ
Case Connection DRAIN DRAIN
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 55 V 100 V
Drain Current-Max (ID) 40 A 34.3 A
Drain-source On Resistance-Max 0.021 Ω 0.023 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code MO-235 MO-235
JESD-30 Code R-PSSO-G4 R-PSSO-G4
JESD-609 Code e3 e3
Moisture Sensitivity Level 1 1
Number of Elements 1 1
Number of Terminals 4 4
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Operating Temperature-Max 175 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type N-CHANNEL N-CHANNEL
Power Dissipation-Max (Abs) 75 W 62.5 W
Pulsed Drain Current-Max (IDM) 160 A 134 A
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Finish TIN TIN
Terminal Form GULL WING GULL WING
Terminal Position SINGLE SINGLE
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 2 2
HTS Code 8541.29.00.75
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

Compare PH1955L,115 with alternatives

Compare PH20100S,115 with alternatives