PHM30NQ10T,518
vs
PSMN020-100YS
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SOT
Package Description
SMALL OUTLINE, R-PDSO-N8
PLASTIC, LFPAK-4
Pin Count
8
235
Manufacturer Package Code
SOT685-1
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
Configuration
SINGLE WITH BUILT-IN DIODE
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min
100 V
100 V
Drain Current-Max (ID)
37.6 A
43 A
Drain-source On Resistance-Max
0.02 Ω
0.0205 Ω
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
JESD-30 Code
R-PDSO-N8
R-PSSO-G4
Number of Elements
1
1
Number of Terminals
8
4
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Operating Temperature-Max
150 °C
175 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Pulsed Drain Current-Max (IDM)
60 A
172 A
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
NO LEAD
GULL WING
Terminal Position
DUAL
SINGLE
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
1
2
Rohs Code
Yes
Avalanche Energy Rating (Eas)
71 mJ
Case Connection
DRAIN
JEDEC-95 Code
MO-235
JESD-609 Code
e3
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Power Dissipation-Max (Abs)
106 W
Terminal Finish
Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
30
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