GTL2002DC,118 vs GTL2002GM feature comparison

GTL2002DC,118 NXP Semiconductors

Buy Now Datasheet

GTL2002GM NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SSOP QFN
Package Description 2.30 MM WIDTH, PLASTIC, MO-187, SOT765-1, VSSOP-8 VQCCN,
Pin Count 8 8
Manufacturer Package Code SOT765-1
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature Also required VDREF 0 to 5.5V Also required VDREF 0 to 5.5V
Interface IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 Code R-PDSO-G8 S-PQCC-N8
JESD-609 Code e4 e4
Length 2.3 mm 1.6 mm
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSSOP HVQCCN
Package Equivalence Code TSSOP8,.12,20 LCC8,.06SQ,20
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 0.5 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min
Supply Voltage1-Max 5.5 V 5.5 V
Supply Voltage1-Min
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 2 mm 1.6 mm
Base Number Matches 1 1
Samacsys Manufacturer NXP

Compare GTL2002DC,118 with alternatives

Compare GTL2002GM with alternatives