GTL2002DC,118
vs
MAX14591ETA+T
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
SSOP
|
DFN
|
| Package Description |
2.30 MM WIDTH, PLASTIC, MO-187, SOT765-1, VSSOP-8
|
2 X 2 MM, ROHS COMPLIANT, TDFN-8
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
SOT765-1
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
Also required VDREF 0 to 5.5V
|
|
| Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| JESD-30 Code |
R-PDSO-G8
|
S-PDSO-N8
|
| JESD-609 Code |
e4
|
e4
|
| Length |
2.3 mm
|
2 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSSOP
|
VSON
|
| Package Equivalence Code |
TSSOP8,.12,20
|
SOCC8,.2,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
0.8 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
|
0.9 V
|
| Supply Voltage1-Max |
5.5 V
|
5.5 V
|
| Supply Voltage1-Min |
|
1.65 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
2 mm
|
2 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| Supply Voltage-Nom |
|
1.2 V
|
| Supply Voltage1-Nom |
|
3 V
|
| Technology |
|
BICMOS
|
|
|
|
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