GTL2002GM
vs
LSF0102YZT
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFN
|
|
| Package Description |
VQCCN,
|
VFBGA,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Additional Feature |
Also required VDREF 0 to 5.5V
|
|
| Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| JESD-30 Code |
S-PQCC-N8
|
R-PBGA-B8
|
| JESD-609 Code |
e4
|
|
| Length |
1.6 mm
|
1.888 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
VFBGA
|
| Package Equivalence Code |
LCC8,.06SQ,20
|
BGA8,2X4,20
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.5 mm
|
0.625 mm
|
| Supply Voltage-Max |
5.5 V
|
4.5 V
|
| Supply Voltage-Min |
|
1 V
|
| Supply Voltage1-Max |
5.5 V
|
5.5 V
|
| Supply Voltage1-Min |
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1.6 mm
|
0.888 mm
|
| Base Number Matches |
1
|
1
|
| Supply Voltage-Nom |
|
3.3 V
|
| Supply Voltage1-Nom |
|
3.3 V
|
|
|
|
Compare GTL2002GM with alternatives
Compare LSF0102YZT with alternatives