GTL2002GM
vs
NVT2002DP
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
QFN
|
SOIC
|
Package Description |
VQCCN,
|
TSSOP,
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
NXP
|
NXP
|
Additional Feature |
Also required VDREF 0 to 5.5V
|
|
Interface IC Type |
INTERFACE CIRCUIT
|
|
JESD-30 Code |
S-PQCC-N8
|
|
JESD-609 Code |
e4
|
|
Length |
1.6 mm
|
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
|
Number of Terminals |
8
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
HVQCCN
|
|
Package Equivalence Code |
LCC8,.06SQ,20
|
|
Package Shape |
SQUARE
|
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.5 mm
|
|
Supply Voltage-Max |
5.5 V
|
|
Supply Voltage-Min |
|
|
Supply Voltage1-Max |
5.5 V
|
|
Supply Voltage1-Min |
|
|
Surface Mount |
YES
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
Terminal Form |
NO LEAD
|
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
QUAD
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
1.6 mm
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare GTL2002GM with alternatives
Compare NVT2002DP with alternatives