Parametric results for: 27C64 under EPROMs

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Manufacturer Part Number: 27c64
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WS27C64F-90DMB
Waferscale Integration Inc
Check for Price No Obsolete 65.536 kbit 8 8KX8 5 V 90 ns UVPROM CARD COMMON 1 8000 8.192 k ASYNCHRONOUS 3-STATE PARALLEL 13.5 V 200 µA 68 µA 5.5 V 4.5 V CMOS MILITARY R-GDIP-T28 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 28 CERAMIC, GLASS-SEALED DIP DIP28,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL WAFERSCALE INTEGRATION INC unknown 3A001.A.2.C 8542.32.00.61
AM27C64-150DI
AMD
Check for Price No Obsolete 65.536 kbit 8 8KX8 5 V 150 ns UVPROM COMMON 1 8000 8.192 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 25 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-CDIP-T28 Not Qualified e0 85 °C -40 °C 28 CERAMIC, METAL-SEALED COFIRED DIP DIP28,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL ADVANCED MICRO DEVICES INC unknown EAR99 8542.32.00.61 DIP DIP, DIP28,.6 28
27C64-15E/J
Microchip Technology Inc
Check for Price No No Obsolete 65.536 kbit 8 8KX8 5 V 150 ns EPROM COMMON 1 8000 8.192 k ASYNCHRONOUS 3-STATE PARALLEL 13 V 100 µA 25 µA 5.5 V 4.5 V CMOS AUTOMOTIVE R-GDIP-T28 Not Qualified e0 125 °C -40 °C 28 CERAMIC, GLASS-SEALED DIP DIP28,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL MICROCHIP TECHNOLOGY INC unknown EAR99 8542.32.00.61 DIP 0.600 INCH, CERDIP-28 28
AM27C64-45LIB
AMD
Check for Price No Obsolete 65.536 kbit 8 8KX8 5 V 45 ns UVPROM COMMON 1 8000 8.192 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 25 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-CQCC-N32 Not Qualified e0 85 °C -40 °C 32 CERAMIC, METAL-SEALED COFIRED WQCCN LCC32(UNSPEC) RECTANGULAR CHIP CARRIER, WINDOW YES Tin/Lead (Sn/Pb) NO LEAD 1.27 mm QUAD 3.556 mm 13.97 mm 11.43 mm ADVANCED MICRO DEVICES INC unknown EAR99 8542.32.00.61 QFJ WQCCN, LCC32(UNSPEC) 32
AM27C64-255DCB
Rochester Electronics LLC
Check for Price Contact Manufacturer 65.536 kbit 8 8KX8 5 V 250 ns UVPROM 1 8000 8.192 k ASYNCHRONOUS PARALLEL 25 µA 5.25 V 4.75 V CMOS COMMERCIAL R-CDIP-T28 e0 70 °C 28 CERAMIC, METAL-SEALED COFIRED DIP RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE DUAL ROCHESTER ELECTRONICS LLC unknown EAR99 8542.32.00.61 DIP,
AM27C64-155DCB
AMD
Check for Price No Obsolete 65.536 kbit 8 8KX8 5 V 150 ns UVPROM COMMON 1 8000 8.192 k ASYNCHRONOUS 3-STATE PARALLEL 12.5 V 100 µA 30 µA 5.25 V 4.75 V CMOS COMMERCIAL R-GDIP-T28 Not Qualified 70 °C 28 CERAMIC, GLASS-SEALED WDIP DIP28,.6 RECTANGULAR IN-LINE, WINDOW NO THROUGH-HOLE 2.54 mm DUAL 5.588 mm 37.1475 mm 15.24 mm ADVANCED MICRO DEVICES INC unknown EAR99 8542.32.00.61 DIP WDIP, DIP28,.6 28
WS27C64F-90D
Waferscale Integration Inc
Check for Price No Obsolete 65.536 kbit 8 8KX8 5 V 90 ns UVPROM CARD COMMON 1 8000 8.192 k ASYNCHRONOUS 3-STATE PARALLEL 13.5 V 35 µA CMOS COMMERCIAL R-XDIP-T28 Not Qualified e0 70 °C 28 CERAMIC DIP DIP28,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL WAFERSCALE INTEGRATION INC unknown EAR99 8542.32.00.61
WS27C64F-10CMH
Waferscale Integration Inc
Check for Price No Obsolete 65.536 kbit 8 8KX8 5 V 100 ns UVPROM CARD COMMON 1 8000 8.192 k ASYNCHRONOUS 3-STATE PARALLEL 13.5 V 30 µA CMOS MILITARY R-XQCC-N32 Not Qualified e0 125 °C -55 °C MIL-STD-883 Class B (Modified) 32 CERAMIC QCCN LCC32,.45X.55 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn/Pb) NO LEAD 1.27 mm QUAD WAFERSCALE INTEGRATION INC unknown 3A001.A.2.C 8542.32.00.61
MD27C6425
Intel Corporation
Check for Price No Obsolete 65.536 kbit 8 8KX8 5 V 250 ns UVPROM COMMON 1 8000 8.192 k ASYNCHRONOUS 3-STATE PARALLEL 12.5 V 140 µA 30 µA 5.5 V 4.5 V CMOS R-XDIP-T28 e0 70 °C 28 UNSPECIFIED DIP DIP28,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE DUAL INTEL CORP compliant EAR99 8542.32.00.61 DIP-28
27C64MQ30
Thales Group
Check for Price Transferred 65.536 kbit 8 8KX8 5 V 300 ns UVPROM 1 8000 8.192 k ASYNCHRONOUS PARALLEL 5.5 V 4.5 V CMOS MILITARY R-GDIP-T28 Not Qualified 125 °C -55 °C 28 CERAMIC, GLASS-SEALED RECTANGULAR IN-LINE NO THROUGH-HOLE DUAL THOMSON-CSF SEMICONDUCTORS unknown 3A001.A.2.C 8542.32.00.61 DIP , 28