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WS27C64F-90DMB
Waferscale Integration Inc
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 90 ns | UVPROM CARD | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13.5 V | 200 µA | 68 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | CERAMIC, GLASS-SEALED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | WAFERSCALE INTEGRATION INC | unknown | 3A001.A.2.C | 8542.32.00.61 | |||||||||
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AM27C64-150DI
AMD
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 150 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 100 µA | 25 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-CDIP-T28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | ADVANCED MICRO DEVICES INC | unknown | EAR99 | 8542.32.00.61 | DIP | DIP, DIP28,.6 | 28 | |||||||
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27C64-15E/J
Microchip Technology Inc
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Check for Price | No | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 150 ns | EPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 100 µA | 25 µA | 5.5 V | 4.5 V | CMOS | AUTOMOTIVE | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -40 °C | 28 | CERAMIC, GLASS-SEALED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8542.32.00.61 | DIP | 0.600 INCH, CERDIP-28 | 28 | ||||||
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AM27C64-45LIB
AMD
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 45 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 100 µA | 25 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-CQCC-N32 | Not Qualified | e0 | 85 °C | -40 °C | 32 | CERAMIC, METAL-SEALED COFIRED | WQCCN | LCC32(UNSPEC) | RECTANGULAR | CHIP CARRIER, WINDOW | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | ADVANCED MICRO DEVICES INC | unknown | EAR99 | 8542.32.00.61 | QFJ | WQCCN, LCC32(UNSPEC) | 32 | ||||
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AM27C64-255DCB
Rochester Electronics LLC
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Check for Price | Contact Manufacturer | 65.536 kbit | 8 | 8KX8 | 5 V | 250 ns | UVPROM | 1 | 8000 | 8.192 k | ASYNCHRONOUS | PARALLEL | 25 µA | 5.25 V | 4.75 V | CMOS | COMMERCIAL | R-CDIP-T28 | e0 | 70 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | DUAL | ROCHESTER ELECTRONICS LLC | unknown | EAR99 | 8542.32.00.61 | DIP, | ||||||||||||||||||
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AM27C64-155DCB
AMD
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 150 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 100 µA | 30 µA | 5.25 V | 4.75 V | CMOS | COMMERCIAL | R-GDIP-T28 | Not Qualified | 70 °C | 28 | CERAMIC, GLASS-SEALED | WDIP | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 37.1475 mm | 15.24 mm | ADVANCED MICRO DEVICES INC | unknown | EAR99 | 8542.32.00.61 | DIP | WDIP, DIP28,.6 | 28 | |||||||
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WS27C64F-90D
Waferscale Integration Inc
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 90 ns | UVPROM CARD | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13.5 V | 35 µA | CMOS | COMMERCIAL | R-XDIP-T28 | Not Qualified | e0 | 70 °C | 28 | CERAMIC | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | WAFERSCALE INTEGRATION INC | unknown | EAR99 | 8542.32.00.61 | ||||||||||||||
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WS27C64F-10CMH
Waferscale Integration Inc
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 100 ns | UVPROM CARD | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13.5 V | 30 µA | CMOS | MILITARY | R-XQCC-N32 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 Class B (Modified) | 32 | CERAMIC | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | WAFERSCALE INTEGRATION INC | unknown | 3A001.A.2.C | 8542.32.00.61 | ||||||||||||
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MD27C6425
Intel Corporation
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 250 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 140 µA | 30 µA | 5.5 V | 4.5 V | CMOS | R-XDIP-T28 | e0 | 70 °C | 28 | UNSPECIFIED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | DUAL | INTEL CORP | compliant | EAR99 | 8542.32.00.61 | DIP-28 | |||||||||||||
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27C64MQ30
Thales Group
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Check for Price | Transferred | 65.536 kbit | 8 | 8KX8 | 5 V | 300 ns | UVPROM | 1 | 8000 | 8.192 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | 125 °C | -55 °C | 28 | CERAMIC, GLASS-SEALED | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | THOMSON-CSF SEMICONDUCTORS | unknown | 3A001.A.2.C | 8542.32.00.61 | DIP | , | 28 |