Part Details for WS27C64F-90DMB by Waferscale Integration Inc
Overview of WS27C64F-90DMB by Waferscale Integration Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for WS27C64F-90DMB
WS27C64F-90DMB CAD Models
WS27C64F-90DMB Part Data Attributes:
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WS27C64F-90DMB
Waferscale Integration Inc
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Datasheet
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WS27C64F-90DMB
Waferscale Integration Inc
UVPROM, 8KX8, 90ns, CMOS, CDIP28,
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WAFERSCALE INTEGRATION INC | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 90 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Memory Density | 65536 bit | |
| Memory IC Type | UVPROM CARD | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 8KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 13.5 V | |
| Qualification Status | Not Qualified | |
| Screening Level | 38535Q/M;38534H;883B | |
| Standby Current-Max | 0.0002 A | |
| Supply Current-Max | 0.068 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |
Alternate Parts for WS27C64F-90DMB
This table gives cross-reference parts and alternative options found for WS27C64F-90DMB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS27C64F-90DMB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY27C64-200WI | UVPROM, 8KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | WS27C64F-90DMB vs CY27C64-200WI |
| LH5764J-20 | UVPROM, 8KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28 | Sharp Corp | WS27C64F-90DMB vs LH5764J-20 |
| CY27C64-200WM | UVPROM, 8KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | WS27C64F-90DMB vs CY27C64-200WM |
| 27C64-12E/J | 8K X 8 UVPROM, 120 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | WS27C64F-90DMB vs 27C64-12E/J |
| QP27C64-35/YA | UVPROM, 8KX8, 350ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | e2v technologies | WS27C64F-90DMB vs QP27C64-35/YA |
| 27C64-20E/J | 8K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | WS27C64F-90DMB vs 27C64-20E/J |
| 27C64-12/J | 8K X 8 UVPROM, 120 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | WS27C64F-90DMB vs 27C64-12/J |
| QP27C64-12/YA | UVPROM, 8KX8, 350ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | e2v technologies | WS27C64F-90DMB vs QP27C64-12/YA |
| 8510206YX | UVPROM, CMOS, CDIP28, | e2v technologies | WS27C64F-90DMB vs 8510206YX |
| MSM2764A-12AS | UVPROM, 8KX8, 120ns, NMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | OKI Electric Industry Co Ltd | WS27C64F-90DMB vs MSM2764A-12AS |