Part Details for 27C64MQ30 by Thales Group
Overview of 27C64MQ30 by Thales Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Part Details for 27C64MQ30
27C64MQ30 CAD Models
27C64MQ30 Part Data Attributes:
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27C64MQ30
Thales Group
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Datasheet
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27C64MQ30
Thales Group
UVPROM, 8KX8, 300ns, CMOS, CDIP28, CERAMIC, DIP-28
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | THOMSON-CSF SEMICONDUCTORS | |
| Part Package Code | DIP | |
| Package Description | , | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 300 ns | |
| JESD-30 Code | R-GDIP-T28 | |
| Memory Density | 65536 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 8KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |
Alternate Parts for 27C64MQ30
This table gives cross-reference parts and alternative options found for 27C64MQ30. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 27C64MQ30, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MBM2764-30-XZ | UVPROM, 8KX8, 300ns, NMOS, CDIP28, CERDIP-28 | FUJITSU Semiconductor Limited | 27C64MQ30 vs MBM2764-30-XZ |
| QD2764A-3 | UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Intel Corporation | 27C64MQ30 vs QD2764A-3 |
| AM2764A-30DI | UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | 27C64MQ30 vs AM2764A-30DI |
| TS27C64A-30XCQ | 8KX8 UVPROM, 300ns, CDIP28, CERAMIC, FDIP-28 | STMicroelectronics | 27C64MQ30 vs TS27C64A-30XCQ |
| AM27C64-300DE | UVPROM, 8KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | 27C64MQ30 vs AM27C64-300DE |
| MBM27C64-30-XZ | 8KX8 UVPROM, 300ns, CDIP28, CERDIP-28 | FUJITSU Limited | 27C64MQ30 vs MBM27C64-30-XZ |
| AM27C64-300DEB | UVPROM, 8KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | 27C64MQ30 vs AM27C64-300DEB |
| MBM27C64-30-XZ | UVPROM, 8KX8, 300ns, CMOS, CDIP28, CERDIP-28 | FUJITSU Semiconductor Limited | 27C64MQ30 vs MBM27C64-30-XZ |
| 27C64MQ30 | UVPROM, 8KX8, 300ns, CMOS, CDIP28, CERAMIC, DIP-28 | e2v technologies | 27C64MQ30 vs 27C64MQ30 |
| TS27C64A-30CQ | 8KX8 UVPROM, 300ns, CDIP28, CERAMIC, FDIP-28 | STMicroelectronics | 27C64MQ30 vs TS27C64A-30CQ |