Part Details for AM27C64-255DCB by Rochester Electronics LLC
Overview of AM27C64-255DCB by Rochester Electronics LLC
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Part Details for AM27C64-255DCB
AM27C64-255DCB CAD Models
AM27C64-255DCB Part Data Attributes:
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AM27C64-255DCB
Rochester Electronics LLC
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Datasheet
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AM27C64-255DCB
Rochester Electronics LLC
UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28
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Part Life Cycle Code | Contact Manufacturer | |
Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
Package Description | DIP, | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 250 ns | |
JESD-30 Code | R-CDIP-T28 | |
JESD-609 Code | e0 | |
Memory Density | 65536 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 8192 words | |
Number of Words Code | 8000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 8KX8 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Supply Current-Max | 0.025 mA | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Position | DUAL |
Alternate Parts for AM27C64-255DCB
This table gives cross-reference parts and alternative options found for AM27C64-255DCB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C64-255DCB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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AT27C256R-12RI | OTP ROM, 32KX8, 120ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, SOIC-28 | Atmel Corporation | AM27C64-255DCB vs AT27C256R-12RI |
AM27C64-250DC | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | Rochester Electronics LLC | AM27C64-255DCB vs AM27C64-250DC |
5962-8751407YX | EEPROM, 8KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Pyramid Semiconductor Corporation | AM27C64-255DCB vs 5962-8751407YX |
5962-8751407YC | EEPROM, 8KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Atmel Corporation | AM27C64-255DCB vs 5962-8751407YC |
WMF512K8-70DEI5 | Flash, 512KX8, 70ns, CDSO32, 0.400 INCH, HERMETIC SEALED, CERAMIC, SOJ-32 | Mercury Systems Inc | AM27C64-255DCB vs WMF512K8-70DEI5 |
5962-8751406XX | EEPROM, 8KX8, 350ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | Pyramid Semiconductor Corporation | AM27C64-255DCB vs 5962-8751406XX |
AM27C64-200DI | UVPROM, 8KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | Rochester Electronics LLC | AM27C64-255DCB vs AM27C64-200DI |
WS57C256F-55L | UVPROM, 32KX8, 55ns, CMOS, CQCC32, CERAMIC, LDCC-32 | e2v technologies | AM27C64-255DCB vs WS57C256F-55L |
CY7C263-55QMB | UVPROM, 8KX8, 55ns, CMOS, CQCC28, WINDOWED, LCC-28 | Cypress Semiconductor | AM27C64-255DCB vs CY7C263-55QMB |
5962-8751402ZX | EEPROM, | Xicor Inc | AM27C64-255DCB vs 5962-8751402ZX |