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Parametric results for: Telephone Circuits

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MB4517P
 FUJITSU Limited 		Check for Price No Obsolete 20 V BIPOLAR 3.5 mA OTHER R-PDIP-T14 e0 Not Qualified 60 °C -30 °C 14 PLASTIC/EPOXY DIP DIP14,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL FUJITSU LTD DIP DIP, DIP14,.3 14 unknown 8542.39.00.01
W91434
 Winbond Electronics Corp 		Check for Price No Obsolete 2.5 V CMOS 3.58 MHz REPERTORY 1 mA COMMERCIAL R-PDIP-T18 e0 Not Qualified 70 °C -20 °C 18 PLASTIC/EPOXY DIP DIP18,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL WINBOND ELECTRONICS CORP not_compliant 8542.39.00.01
KS58015D
 Samsung Semiconductor 		Check for Price No Obsolete 3 V CMOS TELEPHONE DIALER CIRCUIT 3.58 MHz 1 1.5 µA OTHER R-PDSO-G14 e0 Not Qualified 70 °C -30 °C 14 PLASTIC/EPOXY SOP SOP14,.25 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 3.95 mm 8.56 mm 1.95 mm SAMSUNG SEMICONDUCTOR INC SOIC 0.225 INCH, SOP-14 14 unknown 8542.39.00.01
S2559E-P
 AMI Semiconductor 		Check for Price No Obsolete 5 V CMOS TELEPHONE DIALER CIRCUIT 3.58 MHz 1 16 mA COMMERCIAL R-PDIP-T16 e0 Not Qualified 70 °C 16 PLASTIC/EPOXY DIP DIP16,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL 7.62 mm 19.495 mm 4.32 mm AMI SEMICONDUCTOR PLASTIC, DIP-16 unknown
TEA1098H
 NXP Semiconductors 		Check for Price Obsolete 3 V BIPOLAR TELEPHONE SPEECH CIRCUIT 1 COMMERCIAL EXTENDED S-PQFP-G44 e3 Not Qualified 75 °C -25 °C 44 PLASTIC/EPOXY QFP SQUARE FLATPACK YES TIN GULL WING 800 µm QUAD 10 mm 10 mm 2.1 mm NXP SEMICONDUCTORS QFP QFP, 44 unknown 8542.39.00.01
TA31076F-TP2
 Toshiba America Electronic Components 		Check for Price No No Active TELEPHONE RINGER CIRCUIT 1 COMMERCIAL R-PDSO-G10 e0 Not Qualified 70 °C -20 °C 10 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES TIN LEAD GULL WING 1 mm DUAL 4.4 mm 5.2 mm 1.9 mm TOSHIBA CORP SSOP SSOP, 10 unknown 8542.39.00.01
W91340
 Winbond Electronics Corp 		Check for Price No Obsolete 2.5 V CMOS 3.58 MHz 500 µA COMMERCIAL R-PDIP-T18 e0 Not Qualified 70 °C -20 °C 18 PLASTIC/EPOXY DIP DIP18,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL WINBOND ELECTRONICS CORP not_compliant 8542.39.00.01
BA8213FP
 ROHM Semiconductor 		Check for Price Obsolete TELEPHONE SPEECH CIRCUIT 1 R-PDSO-G25 Not Qualified 25 PLASTIC/EPOXY HSSOP RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH YES GULL WING 800 µm DUAL 5.4 mm 13.6 mm 2.11 mm ROHM CO LTD SOIC HSSOP, 25 unknown 8542.39.00.01
SA5456/1
 South African Micro-Electronic Systems Ltd 		Check for Price No Obsolete 2.5 V CMOS 560 kHz 1 µA OTHER R-PDIP-T20 e0 Not Qualified 70 °C -25 °C 20 PLASTIC/EPOXY DIP DIP20,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL SOUTH AFRICAN MICRO-ELECTRONIC SYSTEMS LTD DIP, DIP20,.3 unknown 8542.39.00.01
PBL3726/18SO
 Ericsson 		Check for Price Obsolete TELEPHONE SPEECH CIRCUIT 1 OTHER R-PDSO-G20 Not Qualified 70 °C -40 °C 20 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 7.5 mm 12.8 mm 2.65 mm ERICSSON POWER MODULES AB SOIC SOP, 20 unknown 8542.39.00.01
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