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21 - 30 of 4,164 results
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MB87007AP
FUJITSU Limited
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Check for Price | No | Active | 3.58 MHz | 5 mA | OTHER | R-PDIP-T18 | e0 | Not Qualified | 60 °C | -30 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | FUJITSU LTD | DIP | DIP, DIP18,.3 | 18 | compliant | 8542.39.00.01 | ||||||||||||
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XR-T5992CP
Exar Corporation
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Check for Price | No | Transferred | CMOS | 150 µA | COMMERCIAL | R-PDIP-T18 | e0 | Not Qualified | 70 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | EXAR CORP | DIP, DIP18,.3 | compliant | 8542.39.00.01 | |||||||||||||||
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ICM7102
IC Microsystems Sdn Bhd
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Check for Price | Contact Manufacturer | 3.5 V | CMOS | TELEPHONE MULTIFUNCTION CIRCUIT | 2:3 MAKE/BREAK RATIO IS ALSO SELECTABLE | 1:2 | 1 | OTHER | R-PDSO-G28 | Not Qualified | 70 °C | -25 °C | 28 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 7.49 mm | 17.8308 mm | 2.6416 mm | IC MICROSYSTEMS SDN BHD | SOIC | SOP, | 28 | unknown | 8542.39.00.01 | |||||||||
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MC34014DWR2
Motorola Mobility LLC
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Check for Price | Obsolete | TELEPHONE SPEECH CIRCUIT | 1 | COMMERCIAL | R-PDSO-G20 | Not Qualified | 60 °C | -20 °C | 20 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 7.5 mm | 12.8 mm | 2.65 mm | MOTOROLA INC | SOIC | SOP, | 20 | unknown | 8542.39.00.01 | |||||||||||||
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MA552DP
Zarlink Semiconductor Inc
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Check for Price | No | Transferred | ZARLINK SEMICONDUCTOR INC | , | unknown | ||||||||||||||||||||||||||||||||||
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TEA1064AN
NXP Semiconductors
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Check for Price | Obsolete | 2.8 V | BIPOLAR | TELEPHONE SPEECH CIRCUIT | AVAILABLE ONLY IN NORTH AMERICA | 1 | COMMERCIAL EXTENDED | R-PDIP-T20 | Not Qualified | 75 °C | -25 °C | 20 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 26.73 mm | 4.2 mm | NXP SEMICONDUCTORS | DIP | DIP, | 20 | unknown | 8542.39.00.01 | ||||||||||
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PCD3332-3T
NXP Semiconductors
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Check for Price | Obsolete | 5 V | CMOS | TELEPHONE MULTIFUNCTION CIRCUIT | SELECTABLE MAKE/BREAK RATIO 3:2 | 3.58 MHz | 2:1 | 1 | REPERTORY | 1.8 mA | OTHER | R-PDSO-G28 | Not Qualified | 70 °C | -25 °C | 28 | PLASTIC/EPOXY | SOP | SOP28,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 7.5 mm | 17.9 mm | 2.65 mm | NXP SEMICONDUCTORS | TSSOP | SOP, SOP28,.4 | 28 | compliant | 8542.39.00.01 | |||||
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L3913
STMicroelectronics
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Check for Price | Obsolete | 3.4 V | TELEPHONE MULTIFUNCTION CIRCUIT | SELECTABLE MAKE/BREAK RATIO 1:2 | 1:1.5 | 1 | S-PQCC-J44 | Not Qualified | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 16.5862 mm | 16.5862 mm | 4.57 mm | STMICROELECTRONICS | LCC | QCCJ, | 44 | compliant | 8542.39.00.01 | |||||||||||||
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TEA1068T
NXP Semiconductors
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Check for Price | Obsolete | BIPOLAR | TELEPHONE SPEECH CIRCUIT | 1 | 1.3 µA | COMMERCIAL EXTENDED | R-PDSO-G20 | Not Qualified | 75 °C | -25 °C | 20 | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 7.5 mm | 12.8 mm | 2.65 mm | NXP SEMICONDUCTORS | SOIC | SOP, SOP20,.4 | 20 | compliant | 8542.39.00.01 | ||||||||||
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W91435
Winbond Electronics Corp
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Check for Price | No | Obsolete | 2.5 V | CMOS | 3.58 MHz | REPERTORY | 1 mA | COMMERCIAL | R-PDIP-T18 | e0 | Not Qualified | 70 °C | -20 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | WINBOND ELECTRONICS CORP | not_compliant | 8542.39.00.01 |