Filter Your Search
1 - 10 of 4,164 results
|
TA31050N
Toshiba America Electronic Components
|
Check for Price | No | No | Active | 5 V | SPEAKER PHONE CIRCUIT | 1 | 25 mA | COMMERCIAL EXTENDED | R-PDIP-T42 | e0 | Not Qualified | 75 °C | -30 °C | 42 | PLASTIC/EPOXY | SDIP | RECTANGULAR | IN-LINE, SHRINK PITCH | NO | TIN LEAD | THROUGH-HOLE | 1.778 mm | DUAL | 15.24 mm | 38 mm | 4.5 mm | TOSHIBA CORP | DIP | SDIP, | 42 | unknown | 8542.39.00.01 | ||||||||
|
ICM7102
IC Microsystems Sdn Bhd
|
Check for Price | Contact Manufacturer | 3.5 V | CMOS | TELEPHONE MULTIFUNCTION CIRCUIT | 2:3 MAKE/BREAK RATIO IS ALSO SELECTABLE | 1:2 | 1 | OTHER | R-PDSO-G28 | Not Qualified | 70 °C | -25 °C | 28 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 7.49 mm | 17.8308 mm | 2.6416 mm | IC MICROSYSTEMS SDN BHD | SOIC | SOP, | 28 | unknown | 8542.39.00.01 | ||||||||||
|
MC34014DWR2
Motorola Mobility LLC
|
Check for Price | Obsolete | TELEPHONE SPEECH CIRCUIT | 1 | COMMERCIAL | R-PDSO-G20 | Not Qualified | 60 °C | -20 °C | 20 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 7.5 mm | 12.8 mm | 2.65 mm | MOTOROLA INC | SOIC | SOP, | 20 | unknown | 8542.39.00.01 | ||||||||||||||
|
TEA1064AN
NXP Semiconductors
|
Check for Price | Obsolete | 2.8 V | BIPOLAR | TELEPHONE SPEECH CIRCUIT | AVAILABLE ONLY IN NORTH AMERICA | 1 | COMMERCIAL EXTENDED | R-PDIP-T20 | Not Qualified | 75 °C | -25 °C | 20 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 26.73 mm | 4.2 mm | NXP SEMICONDUCTORS | DIP | DIP, | 20 | unknown | 8542.39.00.01 | |||||||||||
|
PCD3332-3T
NXP Semiconductors
|
Check for Price | Obsolete | 5 V | CMOS | TELEPHONE MULTIFUNCTION CIRCUIT | SELECTABLE MAKE/BREAK RATIO 3:2 | 3.58 MHz | 2:1 | 1 | REPERTORY | 1.8 mA | OTHER | R-PDSO-G28 | Not Qualified | 70 °C | -25 °C | 28 | PLASTIC/EPOXY | SOP | SOP28,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 7.5 mm | 17.9 mm | 2.65 mm | NXP SEMICONDUCTORS | TSSOP | SOP, SOP28,.4 | 28 | compliant | 8542.39.00.01 | ||||||
|
L3913
STMicroelectronics
|
Check for Price | Obsolete | 3.4 V | TELEPHONE MULTIFUNCTION CIRCUIT | SELECTABLE MAKE/BREAK RATIO 1:2 | 1:1.5 | 1 | S-PQCC-J44 | Not Qualified | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 16.5862 mm | 16.5862 mm | 4.57 mm | STMICROELECTRONICS | LCC | QCCJ, | 44 | compliant | 8542.39.00.01 | ||||||||||||||
|
TEA1068T
NXP Semiconductors
|
Check for Price | Obsolete | BIPOLAR | TELEPHONE SPEECH CIRCUIT | 1 | 1.3 µA | COMMERCIAL EXTENDED | R-PDSO-G20 | Not Qualified | 75 °C | -25 °C | 20 | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 7.5 mm | 12.8 mm | 2.65 mm | NXP SEMICONDUCTORS | SOIC | SOP, SOP20,.4 | 20 | compliant | 8542.39.00.01 | |||||||||||
|
KS58015D
Samsung Semiconductor
|
Check for Price | No | Obsolete | 3 V | CMOS | TELEPHONE DIALER CIRCUIT | 3.58 MHz | 1 | 1.5 µA | OTHER | R-PDSO-G14 | e0 | Not Qualified | 70 °C | -30 °C | 14 | PLASTIC/EPOXY | SOP | SOP14,.25 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 3.95 mm | 8.56 mm | 1.95 mm | SAMSUNG SEMICONDUCTOR INC | SOIC | 0.225 INCH, SOP-14 | 14 | unknown | 8542.39.00.01 | ||||||
|
S2559E-P
AMI Semiconductor
|
Check for Price | No | Obsolete | 5 V | CMOS | TELEPHONE DIALER CIRCUIT | 3.58 MHz | 1 | 16 mA | COMMERCIAL | R-PDIP-T16 | e0 | Not Qualified | 70 °C | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 19.495 mm | 4.32 mm | AMI SEMICONDUCTOR | PLASTIC, DIP-16 | unknown | ||||||||||
|
TEA1098H
NXP Semiconductors
|
Check for Price | Obsolete | 3 V | BIPOLAR | TELEPHONE SPEECH CIRCUIT | 1 | COMMERCIAL EXTENDED | S-PQFP-G44 | e3 | Not Qualified | 75 °C | -25 °C | 44 | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | YES | TIN | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | 2.1 mm | NXP SEMICONDUCTORS | QFP | QFP, | 44 | unknown | 8542.39.00.01 |