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MAX2851ITK+T
 Maxim Integrated Products 		Check for Price Yes Yes Transferred 2.85 V BICMOS TELECOM CIRCUIT 1 OTHER S-XQCC-N68 e3 3 85 °C -25 °C 260 30 68 UNSPECIFIED HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 500 µm QUAD 10 mm 10 mm 800 µm MAXIM INTEGRATED PRODUCTS INC HVQCCN, compliant 8542.39.00.01
CY7B923-SC
 Rochester Electronics LLC 		Check for Price No No Active 5 V BICMOS TELECOM CIRCUIT 1 COMMERCIAL R-PDSO-G28 e0 COMMERCIAL 1 70 °C 220 NOT SPECIFIED 28 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 7.5 mm 17.905 mm 2.67 mm ROCHESTER ELECTRONICS LLC 0.300 INCH, PLASTIC, SOIC-28 unknown SOIC 28
XRT7296IP
 Exar Corporation 		Check for Price No Obsolete 5 V BICMOS STS-1/OC-1 51.84 Gbps TELECOM CIRCUIT T-3(DS3) 1 133 µA INDUSTRIAL R-PDIP-T28 e0 Not Qualified 85 °C -40 °C 28 PLASTIC/EPOXY DIP DIP28,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 15.24 mm 37.4 mm 6.35 mm EXAR CORP DIP, DIP28,.6 compliant 8542.39.00.01 DIP 28
MC13193FCR2
 Freescale Semiconductor 		Check for Price Yes Yes Obsolete 2.7 V BICMOS INDUSTRIAL S-PQCC-N32 Not Qualified 3 85 °C -40 °C 260 40 32 PLASTIC/EPOXY QCCN LCC32,.2SQ,20 SQUARE CHIP CARRIER YES NO LEAD 500 µm QUAD FREESCALE SEMICONDUCTOR INC compliant
MC2045-3DIEWP
 Mindspeed Technologies Inc 		Check for Price Obsolete 3.3 V BICMOS TELECOM CIRCUIT 1 INDUSTRIAL R-XUUC-N21 Not Qualified 85 °C -40 °C 21 UNSPECIFIED DIE RECTANGULAR UNCASED CHIP YES NO LEAD UPPER MINDSPEED TECHNOLOGIES INC DIE, compliant 8542.39.00.01 DIE 21
CYV15G0402DXB-BGXI
 Cypress Semiconductor 		Check for Price Yes Yes Obsolete 3.3 V BICMOS 4 1.5 Tbps TELECOM CIRCUIT 1 1.1 mA INDUSTRIAL S-PBGA-B256 e1 Not Qualified 3 85 °C -40 °C 260 20 256 PLASTIC/EPOXY BGA BGA256,20X20,50 SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 27 mm 27 mm 1.745 mm CYPRESS SEMICONDUCTOR CORP BGA, BGA256,20X20,50 compliant 8542.39.00.01 BGA 256
ISL32177EIRZ-T
 Intersil Corporation 		Check for Price Unknown 5 V BICMOS TELECOM CIRCUIT 1 INDUSTRIAL S-PQCC-N24 e3 Not Qualified 3 85 °C -40 °C 260 30 24 PLASTIC/EPOXY HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES Matte Tin (Sn) - annealed NO LEAD 500 µm QUAD 4 mm 4 mm 1 mm INTERSIL CORP HVQCCN, compliant 8542.39.00.01 QFN 24
ATR2733-PLQW
 Atmel Corporation 		Check for Price Yes Obsolete 3.3 V BICMOS TELECOM CIRCUIT 1 INDUSTRIAL S-XQCC-N48 Not Qualified 85 °C -40 °C 48 UNSPECIFIED HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 500 µm QUAD 7 mm 7 mm 1 mm ATMEL CORP HVQCCN, compliant 8542.39.00.01 QFN 48
MAX19985AETX+T
 Maxim Integrated Products 		Check for Price Yes Yes Transferred 5 V BICMOS TELECOM CIRCUIT 1 INDUSTRIAL S-XQCC-N36 e3 Not Qualified 1 85 °C -40 °C 260 30 36 UNSPECIFIED HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 500 µm QUAD 6 mm 6 mm 800 µm MAXIM INTEGRATED PRODUCTS INC 6 X 6 MM, ROHS COMPLIANT, TQFN-36 compliant 8542.39.00.01 QFN 36 5A991.G
SA9024BE
 NXP Semiconductors 		Check for Price Obsolete 3.75 V BICMOS TELECOM CIRCUIT 1 INDUSTRIAL S-PQFP-G48 Not Qualified 85 °C -40 °C 48 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 7 mm 7 mm 1.6 mm NXP SEMICONDUCTORS LFQFP, unknown 8542.39.00.01
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