Parametric results for: Other Telecom ICs

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Sorted By: Technology
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CYW15G0403DXB-BGI
Rochester Electronics LLC
Check for Price No No Active 3.3 V BICMOS TELECOM CIRCUIT 1 INDUSTRIAL S-PBGA-B256 e0 COMMERCIAL 3 85 °C -40 °C 235 NOT SPECIFIED 256 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG YES TIN LEAD BALL 1.27 mm BOTTOM 27 mm 27 mm 1.745 mm ROCHESTER ELECTRONICS LLC BGA 27 X 27 MM, 1.57 MM HEIGHT, BGA-256 256 unknown
ISL32179EIRZ
Intersil Corporation
Check for Price Unknown 3.3 V BICMOS TELECOM CIRCUIT 4 INDUSTRIAL S-PQCC-N24 e3 Not Qualified 3 85 °C -40 °C 260 30 24 PLASTIC/EPOXY HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES Matte Tin (Sn) - annealed NO LEAD 500 µm QUAD 4 mm 4 mm 1 mm INTERSIL CORP QFN HVQCCN, 24 compliant EAR99 8542.39.00.01
MC2045-2YT20
Conexant Systems Inc
Check for Price No Transferred BICMOS TELECOM CIRCUIT 1 20 mA INDUSTRIAL R-PDSO-G20 e0 Not Qualified 85 °C -40 °C 20 PLASTIC/EPOXY TSSOP TSSOP20,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES Tin/Lead (Sn/Pb) GULL WING 635 µm DUAL CONEXANT SYSTEMS TSSOP, TSSOP20,.25 compliant 8542.39.00.01
AN26112A
Panasonic Electronic Components
Check for Price Yes Active 3.3 V BICMOS TELECOM CIRCUIT 1 COMMERCIAL EXTENDED R-PBGA-B6 Not Qualified 80 °C -20 °C 6 PLASTIC/EPOXY VFLGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BUTT 560 µm BOTTOM 1.52 mm 1.72 mm 425 µm PANASONIC CORP LGA VFLGA, 6 unknown 8542.39.00.01
CY7B929DX-AI
Cypress Semiconductor
Check for Price No Obsolete 3.3 V BICMOS TELECOM CIRCUIT 1 INDUSTRIAL R-PQFP-G128 e0 Not Qualified 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 128 PLASTIC/EPOXY LFQFP RECTANGULAR FLATPACK, LOW PROFILE, FINE PITCH YES Tin/Lead (Sn/Pb) GULL WING 500 µm QUAD 14 mm 20 mm 1.6 mm CYPRESS SEMICONDUCTOR CORP QFP LFQFP, 128 unknown 8542.39.00.01
TDA5250D2
Infineon Technologies AG
Check for Price Yes Yes Obsolete 3 V BICMOS TELECOM CIRCUIT 1 INDUSTRIAL R-PDSO-G38 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 38 PLASTIC/EPOXY TSSOP TSSOP38,.25,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL 4.4 mm 9.7 mm 1.2 mm INFINEON TECHNOLOGIES AG TSSOP TSSOP, TSSOP38,.25,20 38 compliant 8542.39.00.01
CXA3668N
Sony Semiconductor
Check for Price Yes Yes Obsolete 2.5 V BICMOS TELECOM CIRCUIT 1 INDUSTRIAL R-PDSO-G24 e6/e4 Not Qualified 85 °C -40 °C 260 10 24 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES GULL WING 650 µm DUAL 5.6 mm 7.8 mm 1.45 mm SONY CORP SSOP LSSOP, 24 unknown 8542.39.00.01
CY7B9233-270JC
Cypress Semiconductor
Check for Price No Transferred 5 V BICMOS TELECOM CIRCUIT 160 mA COMMERCIAL S-PQCC-J28 e0 Not Qualified 70 °C 28 PLASTIC/EPOXY QCCJ LDCC28,.5SQ SQUARE CHIP CARRIER YES Tin/Lead (Sn/Pb) J BEND 1.27 mm QUAD CYPRESS SEMICONDUCTOR CORP compliant 8542.39.00.01
MAX2121ETI+
Maxim Integrated Products
$7.9676 Yes Yes Transferred 3.3 V BICMOS TELECOM CIRCUIT 1 INDUSTRIAL S-XQCC-N28 e3 Not Qualified 1 85 °C -40 °C 260 30 28 UNSPECIFIED QCCN SQUARE CHIP CARRIER YES MATTE TIN NO LEAD 750 µm QUAD 5 mm 5 mm MAXIM INTEGRATED PRODUCTS INC QFN 5 X 5 MM, ROHS COMPLIANT, TQFN-28 28 compliant EAR99 8542.39.00.01
ATR4253C-PVPW
Microchip Technology Inc
Check for Price Yes Active 10 V BICMOS TELECOM CIRCUIT 1 INDUSTRIAL S-XQCC-N16 115 °C -40 °C 16 UNSPECIFIED HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 500 µm QUAD 3 mm 3 mm 1 mm MICROCHIP TECHNOLOGY INC 3 X 3 MM, VQFN-16 compliant EAR99 8542.39.00.01