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AP22802AW5-7
Diodes Incorporated
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$0.1263 | Yes | Not Recommended | 5 V | 1 | LOAD SWITCH | 1 | R-PDSO-G5 | 1 | 85 °C | -40 °C | 260 | 30 | 5 | PLASTIC/EPOXY | LSSOP | TSOP5/6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.6 mm | 3 mm | 1.4 mm | DIODES INC | SOT-25, 5 PIN | compliant | EAR99 | 8542.39.00.01 | Diodes Incorporated | NO | 5.5 V | 2.7 V | ||||||||||||
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AP22802BW5-7
Diodes Incorporated
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$0.1554 | Yes | Not Recommended | 5 V | 1 | LOAD SWITCH | 1 | R-PDSO-G5 | 85 °C | -40 °C | 260 | 5 | PLASTIC/EPOXY | LSSOP | TSOP5/6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.6 mm | 3 mm | 1.4 mm | DIODES INC | SOT-25, 5 PIN | compliant | EAR99 | 8542.39.00.01 | Diodes Incorporated | NO | 5.5 V | 2.7 V | ||||||||||||||
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AP22814BSN-7
Diodes Incorporated
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$0.1634 | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PDSO-N6 | e4 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 650 µm | DUAL | 2 mm | 2 mm | 630 µm | DIODES INC | UDFN-6 | compliant | EAR99 | 8542.39.00.01 | Diodes Incorporated | ||||||||||||||||
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HTMS8001FTB/AF,115
NXP Semiconductors
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$0.1716 | Yes | Active | CMOS | TELECOM CIRCUIT | Not Qualified | 1 | 260 | 3 | PLASTIC/EPOXY | QCCN | LCC3(UNSPEC) | CHIP CARRIER | YES | NO LEAD | QUAD | NXP SEMICONDUCTORS | compliant | NXP | SON | 3 | SOT1122 | ||||||||||||||||||||||||||
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AP22811AM8-13
Diodes Incorporated
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$0.1815 | Yes | Not Recommended | 5 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G8 | e3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 2.95 mm | 3 mm | 1.1 mm | DIODES INC | MSOP-8 | compliant | EAR99 | 8542.39.00.01 | Diodes Incorporated | ||||||||||||||||
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AP22804AM8-13
Diodes Incorporated
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$0.1993 | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | S-PDSO-G8 | e3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 3 mm | 3 mm | 1.1 mm | DIODES INC | , | compliant | EAR99 | 8542.39.00.01 | Diodes Incorporated | ||||||||||||||||
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AP22804AW5-7
Diodes Incorporated
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$0.2078 | Yes | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G5 | e3 | 85 °C | -40 °C | 260 | 30 | 5 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.6 mm | 3 mm | 1.4 mm | DIODES INC | SOT-25,5 PIN | compliant | EAR99 | 8542.39.00.01 | Diodes Incorporated | |||||||||||||||
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AP22800HB-7
Diodes Incorporated
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$0.2150 | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-N8 | e4 | 85 °C | -40 °C | 260 | 8 | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 1.6 mm | 2.1 mm | 605 µm | DIODES INC | 2.10 X 1.60 MM, GREEN, DFN-8 | compliant | EAR99 | 8542.39.00.01 | Diodes Incorporated | |||||||||||||||||
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SL3S1013FTB0,115
NXP Semiconductors
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$0.2155 | Yes | Active | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-N6 | 1 | 85 °C | -40 °C | 260 | 6 | PLASTIC/EPOXY | VSON | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | YES | NO LEAD | 500 µm | DUAL | 1 mm | 1.45 mm | 500 µm | NXP SEMICONDUCTORS | 1.45 X 1 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-252, SOT886F1, XSON-6 | compliant | 8542.32.00 | NXP | SON | 6 | SOT886 | ||||||||||||||||
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AP22814ASN-7
Diodes Incorporated
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$0.2165 | Yes | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PDSO-N6 | e4 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 650 µm | DUAL | 2 mm | 2 mm | 630 µm | DIODES INC | UDFN-6 | compliant | EAR99 | 8542.39.00.01 | Diodes Incorporated |